Compact and broad-band three-dimensional MMIC balun

Author

Nishikawa, Kenjiro ; Toyoda, Ichihiko ; Tokumitsu, Tsuneo

Author_Institution

NTT Wireless Syst. Labs., Yokosuka, Japan

Volume

47

Issue

1

fYear

1999

fDate

1/1/1999 12:00:00 AM

Firstpage

96

Lastpage

98

Abstract

This paper presents a simple and effective technique which compensates for the amplitude and phase differences of the Marchand balun. Compensation is accomplished by interconnecting a short transmission line to a pair of couplers. As a result, Marchand balun with operation frequency ranging as wide as 8.2-30 GHz is achieved. To fabricate the prototype, we adopt three-dimensional monolithic-microwave integrated-circuit technology together with a 2.5 μm×4 layer polyimide structure stacked over a GaAs wafer. The topology yields a circuit area as small as 0.2 mm×0.4 mm for the balun

Keywords

MMIC; baluns; compensation; gallium arsenide; microstrip couplers; 0.2 mm; 0.4 mm; 2.5 micron; 3D MMIC technology; 8.2 to 30 GHz; GaAs; GaAs wafer; Marchand balun; amplitude differences; broadband 3D MMIC balun; compact balun design; compensation; couplers; monolithic microwave integrated circuit technology; phase differences; polyimide structure; short transmission line; three-dimensional MMIC balun; Couplers; Distributed parameter circuits; Frequency; Gallium arsenide; Impedance matching; Integrated circuit interconnections; Integrated circuit technology; MMICs; Polyimides; Prototypes;

fLanguage

English

Journal_Title

Microwave Theory and Techniques, IEEE Transactions on

Publisher

ieee

ISSN

0018-9480

Type

jour

DOI

10.1109/22.740087

Filename

740087