Title :
Compact and broad-band three-dimensional MMIC balun
Author :
Nishikawa, Kenjiro ; Toyoda, Ichihiko ; Tokumitsu, Tsuneo
Author_Institution :
NTT Wireless Syst. Labs., Yokosuka, Japan
fDate :
1/1/1999 12:00:00 AM
Abstract :
This paper presents a simple and effective technique which compensates for the amplitude and phase differences of the Marchand balun. Compensation is accomplished by interconnecting a short transmission line to a pair of couplers. As a result, Marchand balun with operation frequency ranging as wide as 8.2-30 GHz is achieved. To fabricate the prototype, we adopt three-dimensional monolithic-microwave integrated-circuit technology together with a 2.5 μm×4 layer polyimide structure stacked over a GaAs wafer. The topology yields a circuit area as small as 0.2 mm×0.4 mm for the balun
Keywords :
MMIC; baluns; compensation; gallium arsenide; microstrip couplers; 0.2 mm; 0.4 mm; 2.5 micron; 3D MMIC technology; 8.2 to 30 GHz; GaAs; GaAs wafer; Marchand balun; amplitude differences; broadband 3D MMIC balun; compact balun design; compensation; couplers; monolithic microwave integrated circuit technology; phase differences; polyimide structure; short transmission line; three-dimensional MMIC balun; Couplers; Distributed parameter circuits; Frequency; Gallium arsenide; Impedance matching; Integrated circuit interconnections; Integrated circuit technology; MMICs; Polyimides; Prototypes;
Journal_Title :
Microwave Theory and Techniques, IEEE Transactions on
