• DocumentCode
    1465222
  • Title

    Fabrication of 100-nm Metamorphic AlInAs/GaInAs HEMTs Grown on Si Substrates by MOCVD

  • Author

    Li, Ming ; Li, Haiou ; Tang, Chak Wah ; Lau, Kei May

  • Author_Institution
    Dept. of Electron. & Comput. Eng., Hong Kong Univ. of Sci. & Technol., Kowloon, China
  • Volume
    33
  • Issue
    4
  • fYear
    2012
  • fDate
    4/1/2012 12:00:00 AM
  • Firstpage
    498
  • Lastpage
    500
  • Abstract
    High-performance metamorphic Al0.49In0.51As-/Ga0.47-In0.53As high-electron-mobility transistors (mHEMTs) grown on Si substrates by metal-organic chemical vapor deposition (MOCVD) using an effective multistage composite buffer scheme have been fabricated. Room-temperature Hall measurements show an average sheet carrier density of 4.5 × 1012 cm-2 with a mobility of over 7500 cm2/V·s. Maximum transconductance of mHEMTs with a 100-nm gate length was ~ 770 mS/mm, which is nearly the same as that of mHEMTs with the same dimension grown on GaAs substrates by MOCVD. The unity current gain cutoff frequency (fT) and the maximum oscillation frequency (fmax) were 210 and 146 GHz, respectively. To our best knowledge, these results are the best reported for MOCVD-grown mHEMTs on Si.
  • Keywords
    Hall effect; MOCVD; buffer layers; carrier density; elemental semiconductors; high electron mobility transistors; semiconductor growth; silicon; Al0.49In0.51As-Ga0.47In0.53As; MOCVD; Si; carrier density; current gain cutoff frequency; gate length; high-performance metamorphic high-electron-mobility transistors; mHEMT; maximum transconductance; metal-organic chemical vapor deposition; metamorphic HEMT; multistage composite buffer scheme; oscillation frequency; room-temperature Hall measurements; silicon substrates; size 100 nm; Logic gates; MOCVD; MODFETs; Silicon; Substrates; mHEMTs; AlInAs/GaInAs; metal–organic chemical vapor deposition (MOCVD); metamorphic high-electron-mobility transistors (mHEMTs); silicon;
  • fLanguage
    English
  • Journal_Title
    Electron Device Letters, IEEE
  • Publisher
    ieee
  • ISSN
    0741-3106
  • Type

    jour

  • DOI
    10.1109/LED.2012.2186111
  • Filename
    6165639