• DocumentCode
    1465260
  • Title

    A 300-A delta VF tester

  • Author

    Pshaenich, Al

  • Author_Institution
    Motorola Inc., Phoenix, AZ, USA
  • Volume
    39
  • Issue
    4
  • fYear
    1990
  • fDate
    8/1/1990 12:00:00 AM
  • Firstpage
    599
  • Lastpage
    603
  • Abstract
    The design and development of a relatively low-cost, high-current, transient thermal resistance tester are described. The tester, which employs delta techniques, was initially used to measure the die bond integrity of large power handling rectifier assemblies, but because of its versatility it can thermally characterize most semiconductor junctions. Circuit design details and testing of several products are illustrated, including the delta VF and V F measurements of power rectifiers and smart power ICs
  • Keywords
    integrated circuit testing; production testing; semiconductor device testing; test equipment; thermal resistance measurement; transients; voltage measurement; 300 A; delta VF tester; die bond integrity; inspection; power MOSFET switch; power rectifiers; semiconductor junctions; smart power ICs; transient thermal resistance tester; Assembly; Bonding; Circuit synthesis; Circuit testing; Electrical resistance measurement; Power integrated circuits; Power measurement; Rectifiers; Semiconductor device testing; Thermal resistance;
  • fLanguage
    English
  • Journal_Title
    Instrumentation and Measurement, IEEE Transactions on
  • Publisher
    ieee
  • ISSN
    0018-9456
  • Type

    jour

  • DOI
    10.1109/19.57240
  • Filename
    57240
    • Link To Document
    https://search.isc.ac/dl/search/defaultta.aspx?DTC=49&DC=1465260