DocumentCode
146618
Title
Numerical Simulation of 3-D Elastic Moduli with Elliptical Cracks Using FM-DBEM
Author
Lie Jin ; Hongtao Wang ; Haitao Wang ; Xinxin Wu
Author_Institution
Inst. of Nucl. & New Energy Technol., Tsinghua Univ., Beijing, China
fYear
2014
fDate
23-25 Sept. 2014
Firstpage
39
Lastpage
45
Abstract
In the paper, the fast multiple dual boundary element method is applied to simulate the model of a elastic three-dimensional (3-D) isotropic solid with elliptical micro cracks in various sizes and estimate the global effective elastic moduli of the micro crack-weakened solid. Following the previous simulation of solids with circular micro cracks, the present analyses require no interactions of elliptical micro cracks, and investigate the relations between the effective elastic moduli and the micro crack density parameter. Some representative elliptical micro crack models (including randomly distributed micro cracks and a family of parallel micro cracks) are simulated, and compared with some analytic approximate micromechanical solutions. Numerical results shows the elliptical micro cracks can be approximated with good accuracy to be circular cracks in the same crack density. Besides, it can also present an alternative simulation method of structure containing elliptical micro cracks or micro cracks of other shapes in complicate distributing states, and present an accurate effective moduli prediction.
Keywords
boundary-elements methods; elastic moduli; elasticity; finite element analysis; microcracks; 3D elastic moduli; FM-DBEM; circular cracks; circular microcracks; elastic three-dimensional isotropic solid; elliptical microcracks; finite element method; isotropic cube; microcrack density parameter; micromechanical solutions; multiple dual boundary-element method; numerical simulation; parallel microcracks; randomly distributed microcracks; Silicon carbide; Dual boundary element method; Effective elastic moduli; Elliptical microcrack; Fast multipole;
fLanguage
English
Publisher
ieee
Conference_Titel
Embedded Multicore/Manycore SoCs (MCSoc), 2014 IEEE 8th International Symposium on
Conference_Location
Aizu-Wakamatsu
Type
conf
DOI
10.1109/MCSoC.2014.15
Filename
6949451
Link To Document