• DocumentCode
    146618
  • Title

    Numerical Simulation of 3-D Elastic Moduli with Elliptical Cracks Using FM-DBEM

  • Author

    Lie Jin ; Hongtao Wang ; Haitao Wang ; Xinxin Wu

  • Author_Institution
    Inst. of Nucl. & New Energy Technol., Tsinghua Univ., Beijing, China
  • fYear
    2014
  • fDate
    23-25 Sept. 2014
  • Firstpage
    39
  • Lastpage
    45
  • Abstract
    In the paper, the fast multiple dual boundary element method is applied to simulate the model of a elastic three-dimensional (3-D) isotropic solid with elliptical micro cracks in various sizes and estimate the global effective elastic moduli of the micro crack-weakened solid. Following the previous simulation of solids with circular micro cracks, the present analyses require no interactions of elliptical micro cracks, and investigate the relations between the effective elastic moduli and the micro crack density parameter. Some representative elliptical micro crack models (including randomly distributed micro cracks and a family of parallel micro cracks) are simulated, and compared with some analytic approximate micromechanical solutions. Numerical results shows the elliptical micro cracks can be approximated with good accuracy to be circular cracks in the same crack density. Besides, it can also present an alternative simulation method of structure containing elliptical micro cracks or micro cracks of other shapes in complicate distributing states, and present an accurate effective moduli prediction.
  • Keywords
    boundary-elements methods; elastic moduli; elasticity; finite element analysis; microcracks; 3D elastic moduli; FM-DBEM; circular cracks; circular microcracks; elastic three-dimensional isotropic solid; elliptical microcracks; finite element method; isotropic cube; microcrack density parameter; micromechanical solutions; multiple dual boundary-element method; numerical simulation; parallel microcracks; randomly distributed microcracks; Silicon carbide; Dual boundary element method; Effective elastic moduli; Elliptical microcrack; Fast multipole;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Embedded Multicore/Manycore SoCs (MCSoc), 2014 IEEE 8th International Symposium on
  • Conference_Location
    Aizu-Wakamatsu
  • Type

    conf

  • DOI
    10.1109/MCSoC.2014.15
  • Filename
    6949451