Title :
Laminates for printed circuits
Author_Institution :
Synthane Corporation, Oaks, Pa.
Abstract :
The three ingredients and the procedures for manufacturing metal-clad laminates are discussed. Processing methods are varied, but most utilize some form of photoetching or silk screening. Present and future civilian applications of printed circuits also receive attention.
Keywords :
Copper; Etching; Laminates; Presses; Printed circuits; Resins; Resistance;
Journal_Title :
Electrical Engineering
DOI :
10.1109/EE.1955.6439696
