Title : 
Analysis and discussion on conduction current based on simultaneous measurement of TSC and space charge distribution
         
        
            Author : 
Tanaka, Y. ; Kitajima, H. ; Kodaka, M. ; Takada, T.
         
        
            Author_Institution : 
Electron. Meas. Lab., Musashi Inst. of Technol., Tokyo, Japan
         
        
        
        
        
            fDate : 
12/1/1998 12:00:00 AM
         
        
        
        
            Abstract : 
A new analysis of conduction current distributed in dielectrics based on simultaneous measurements of thermally stimulated current (TSC) and time dependent space charge distribution is proposed. A new system pulsed electro-acoustic (PEA) method has been developed to enable simultaneous measurement of the TSC and the dynamic space charge and electric field distributions as a function of temperature within insulators. With the new system, the relationship between the TSC and the time dependent electric field distribution in electron beam (e-beam) irradiated PMMA has been investigated. From the time dependent electric field, the displacement current in dielectrics is obtained. The TSC is a typical external current which is represented as an addition of the displacement current and a conduction current in dielectrics. This paper makes it clear that the conduction current as a function of position is determined by the simultaneous measurement of the external current and the dynamic space charge distribution
         
        
            Keywords : 
electron beam effects; insulation testing; organic insulating materials; space charge; thermally stimulated currents; TSC; conduction current; displacement current; space charge distribution; system pulsed electro-acoustic method; time dependent electric field distribution; Charge measurement; Current measurement; Dielectric measurements; Electric variables measurement; Pulse measurements; Pulsed electroacoustic methods; Space charge; Temperature distribution; Thermal conductivity; Time measurement;
         
        
        
            Journal_Title : 
Dielectrics and Electrical Insulation, IEEE Transactions on