• DocumentCode
    1466974
  • Title

    A better understanding of substrate enhanced gate current in VLSI MOSFETs and flash cells. II. Physical analysis

  • Author

    Selmi, Luca ; Esseni, David

  • Author_Institution
    Dipt. di Elettronica Inf. e Sistemistica, Bologna Univ., Italy
  • Volume
    46
  • Issue
    2
  • fYear
    1999
  • fDate
    2/1/1999 12:00:00 AM
  • Firstpage
    376
  • Lastpage
    382
  • Abstract
    For pt. I see ibid., vol. 46, no. 2 (Feb. 1999). In this work-different physical mechanisms that could lead to the direct proportionality between IG and IB as the signature of substrate enhanced electron injection (SEEI), are analyzed in detail. By means of experiments and simulations we substantiate the current interpretation of SEEI in terms of an impact ionization feedback process and attribute a quantitatively negligible role to both drain avalanche hot electron injection and substrate electrons generated by the photons emitted by channel hot electrons. These experiments reconcile the current explanation of SEEI with the well known phenomenon of photon assisted minority carrier injection in the substrate, whose presence is clearly detectable in our devices, but whose impact on the gate current is estimated to be orders of magnitude smaller than that of impact ionization feedback
  • Keywords
    MOS memory circuits; VLSI; flash memories; hot carriers; impact ionisation; integrated circuit reliability; EPROM; MOSFET; VLSI; channel hot electrons; drain avalanche hot electron injection; flash cells; impact ionization feedback process; minority carrier injection; physical analysis; substrate enhanced electron injection; substrate enhanced gate current; Channel hot electron injection; Charge carrier processes; Electron emission; Feedback; Hot carriers; Impact ionization; MOSFET circuits; Substrate hot electron injection; Very large scale integration; Voltage;
  • fLanguage
    English
  • Journal_Title
    Electron Devices, IEEE Transactions on
  • Publisher
    ieee
  • ISSN
    0018-9383
  • Type

    jour

  • DOI
    10.1109/16.740905
  • Filename
    740905