DocumentCode
1466974
Title
A better understanding of substrate enhanced gate current in VLSI MOSFETs and flash cells. II. Physical analysis
Author
Selmi, Luca ; Esseni, David
Author_Institution
Dipt. di Elettronica Inf. e Sistemistica, Bologna Univ., Italy
Volume
46
Issue
2
fYear
1999
fDate
2/1/1999 12:00:00 AM
Firstpage
376
Lastpage
382
Abstract
For pt. I see ibid., vol. 46, no. 2 (Feb. 1999). In this work-different physical mechanisms that could lead to the direct proportionality between IG and IB as the signature of substrate enhanced electron injection (SEEI), are analyzed in detail. By means of experiments and simulations we substantiate the current interpretation of SEEI in terms of an impact ionization feedback process and attribute a quantitatively negligible role to both drain avalanche hot electron injection and substrate electrons generated by the photons emitted by channel hot electrons. These experiments reconcile the current explanation of SEEI with the well known phenomenon of photon assisted minority carrier injection in the substrate, whose presence is clearly detectable in our devices, but whose impact on the gate current is estimated to be orders of magnitude smaller than that of impact ionization feedback
Keywords
MOS memory circuits; VLSI; flash memories; hot carriers; impact ionisation; integrated circuit reliability; EPROM; MOSFET; VLSI; channel hot electrons; drain avalanche hot electron injection; flash cells; impact ionization feedback process; minority carrier injection; physical analysis; substrate enhanced electron injection; substrate enhanced gate current; Channel hot electron injection; Charge carrier processes; Electron emission; Feedback; Hot carriers; Impact ionization; MOSFET circuits; Substrate hot electron injection; Very large scale integration; Voltage;
fLanguage
English
Journal_Title
Electron Devices, IEEE Transactions on
Publisher
ieee
ISSN
0018-9383
Type
jour
DOI
10.1109/16.740905
Filename
740905
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