DocumentCode
1467040
Title
Electronic packaging and interconnection handbook, 3/sup rd/ edition [Book Review]
Author
Shea, John
Author_Institution
Cutler-Hammer, Inc.
Volume
17
Issue
2
fYear
2001
Firstpage
68
Lastpage
69
Keywords
Book reviews; Chemical technology; Components, packaging, and manufacturing technology; Electronic packaging thermal management; Electronics packaging; Integrated circuit interconnections; Sections; Thermal stresses; Thermomechanical processes; Wiring;
fLanguage
English
Journal_Title
Electrical Insulation Magazine, IEEE
Publisher
ieee
ISSN
0883-7554
Type
jour
DOI
10.1109/MEI.2001.917557
Filename
917557
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