• DocumentCode
    1467087
  • Title

    In Situ Electron Microscopy Mechanical Testing of Silicon Nanowires Using Electrostatically Actuated Tensile Stages

  • Author

    Zhang, Dongfeng ; Breguet, Jean-Marc ; Clavel, Reymond ; Sivakov, Vladimir ; Christiansen, Silke ; Michler, Johann

  • Volume
    19
  • Issue
    3
  • fYear
    2010
  • fDate
    6/1/2010 12:00:00 AM
  • Firstpage
    663
  • Lastpage
    674
  • Abstract
    Two types of electrostatically actuated tensile stages for in situ electron microscopy mechanical testing of 1-D nanostructures were designed, microfabricated, and tested. Testing was carried out for mechanical characterization of silicon nanowires (SiNWs). The bulk micromachined stages consist of a comb-drive actuator and either a differential capacitive sensor or a clamped-clamped beam force sensor. High-aspect-ratio structures (height/gap = 20) were designed to increase the driving force of the geometrically optimized actuator and the sensitivity of the capacitive sensor. The actuator stiffness is kept low to enable high tensile force to be exerted in the specimen rather than in the suspensions of the comb drive. Individual SiNWs were mounted on the devices by in situ scanning electron microscopy nanomanipulation, and their tensile properties were determined to demonstrate the device capability. The phosphorus-doped SiNWs, which were grown in a bottom-up manner by the vapor-liquid-solid process, show an average Young´s modulus of (170.0 ?? 2.4) GPa and a tensile strength of at least 4.2 GPa. Top-down electroless chemically etched SiNWs, with their long axis along the [100] direction, show a fracture strength of 5.4 GPa.
  • Keywords
    Young´s modulus; actuators; capacitive sensors; fracture toughness; fracture toughness testing; nanoelectromechanical devices; nanowires; scanning electron microscopy; tensile strength; 1-D nanostructure design; Young´s modulus; actuator stiffness; bulk micromachined stages; capacitive sensor; clamped-clamped beam force sensor; comb-drive actuator; differential capacitive sensor; electrostatically actuated tensile stages; fracture strength; geometrically optimized actuator; high-aspect-ratio structures; in situ scanning electron microscopy nanomanipulation; mechanical testing; microfabrication; phosphorus-doped SiNW; sensitivity; silicon nanowires; tensile force; tensile strength; top-down electroless; vapor-liquid-solid process; Capacitive sensor; comb drive; nanomechanics; silicon nanowire (SiNW); tensile test;
  • fLanguage
    English
  • Journal_Title
    Microelectromechanical Systems, Journal of
  • Publisher
    ieee
  • ISSN
    1057-7157
  • Type

    jour

  • DOI
    10.1109/JMEMS.2010.2044746
  • Filename
    5445050