Title :
Time-Domain Green´s Function-Based Parametric Sensitivity Analysis of Multiconductor Transmission Lines
Author :
Spina, Domenico ; Ferranti, Francesco ; Antonini, Giulio ; Dhaene, Tom ; Knockaert, Luc ; Vande Ginste, Dries
Author_Institution :
Dept. of Inf. Technol., Ghent Univ., Ghent, Belgium
Abstract :
We present a new parametric macromodeling technique for lossy and dispersive multiconductor transmission lines. This technique can handle multiple design parameters, such as substrate or geometrical layout features, and provide time-domain sensitivity information for voltages and currents at the ports of the lines. It is derived from the dyadic Green´s function of the 1-D wave propagation problem. The rational nature of the Green´s function permits the generation of a time-domain macromodel for the computation of transient voltage and current sensitivities with respect to both electrical and physical parameters, completely avoiding similarity transformation, and it is suited to generate state-space models and synthesize equivalent circuits, which can be easily embedded into conventional SPICE-like solvers. Parametric macromodels that provide sensitivity information are well suited for design space exploration, design optimization, and crosstalk analysis. Two numerical examples validate the proposed approach in both frequency and time-domain.
Keywords :
Green´s function methods; crosstalk; frequency-domain analysis; multiconductor transmission lines; sensitivity analysis; state-space methods; time-domain analysis; wave propagation; 1D wave propagation problem; SPICE-like solvers; crosstalk analysis; current sensitivity; design optimization; design space exploration; dispersive multiconductor transmission lines; dyadic Green´s function; frequency-domain; geometrical layout features; lossy multiconductor transmission lines; multiple design parameters; parametric macromodeling technique; parametric sensitivity analysis; state-space models; synthesize equivalent circuits; time-domain Green´s function method; time-domain macromodel; transient voltage; Computational modeling; Impedance; Mathematical model; Sensitivity analysis; Time domain analysis; Transmission line matrix methods; Interconnects; parametric macromodeling; rational approximation; sensitivity analysis;
Journal_Title :
Components, Packaging and Manufacturing Technology, IEEE Transactions on
DOI :
10.1109/TCPMT.2012.2186570