• DocumentCode
    146830
  • Title

    Design and simulation of dense dielectric patch antenna for wireless applications

  • Author

    Sudharsan, J. ; Ramesh, S.

  • Author_Institution
    Electron. & Commun. Dept., Valliammai Eng. Coll., Chennai, India
  • fYear
    2014
  • fDate
    3-5 April 2014
  • Firstpage
    490
  • Lastpage
    492
  • Abstract
    Wireless communication devices and techniques are proliferating, improving and expanding every day. The development of such device must meet specific requirements: small size, light weight, low cost, and attractive appearance. There are many techniques to improve the characteristics and performance of antennas. A dense dielectric patch in a circular shape for the antenna is proposed here for reduced size copy of the whole. The beneficial give useful applications in cellular telephone and microwave communications. This paper presents the design and simulation of miniaturized single-band dense dielectric patch antenna for wireless applications. The designed antenna is resonating at 3.86 GHz yielding a return loss of about -25.9 dB which is suitable for Wi-MAX, public and private mobile applications. The simulation has been carried out using Agilent Advanced Design SystemEM simulator.
  • Keywords
    WiMax; cellular radio; microstrip antennas; microwave antennas; Agilent Advanced Design SystemEM simulator; Wi-MAX application; cellular telephone communications; frequency 3.86 GHz; loss 25.9 dB; microwave communications; miniaturized single-band dense dielectric patch antenna design; miniaturized single-band dense dielectric patch antenna simulation; private mobile application; public mobile application; wireless applications; Antenna radiation patterns; Dielectrics; Indexes; Shape; Substrates; Dense Dielectric; EM Simulator; Patch Antenna; Wireless Devices;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Communications and Signal Processing (ICCSP), 2014 International Conference on
  • Conference_Location
    Melmaruvathur
  • Print_ISBN
    978-1-4799-3357-0
  • Type

    conf

  • DOI
    10.1109/ICCSP.2014.6949890
  • Filename
    6949890