Title :
Investigation of Back-Bias Capacitance Coupling Coefficient Measurement Methodology for Floating-Gate Nonvolatile Memory Cells
Author :
Beug, M. Florian ; Rafhay, Quentin ; van Duuren, M.J. ; Duane, Russell
Author_Institution :
Phys.-Tech. Bundesanstalt, Braunschweig, Germany
fDate :
6/1/2010 12:00:00 AM
Abstract :
In this paper, we give a thorough investigation of a new capacitance coupling coefficient measurement methodology (a back-bias method) that extracts the gate capacitance coefficient of floating-gate memory cells. This measurement methodology that utilizes simple current-voltage measurements presents several advantages over current methodologies. It includes a figure of merit for determining the matching performance of a reference transistor to a memory cell, which plays a crucial role for the extraction of the correct gate coupling coefficient value. By this means, we investigate, for the first time, the impact of structural differences between a reference transistor and a memory cell on the gate coupling coefficient extraction. The back-bias method is compared with commonly used gate coupling coefficient extraction methods, and it is shown that it has a smaller extraction error for nonmatching reference transistors and memory cell pairs. Furthermore, it is demonstrated how the gate coupling coefficient extraction can be corrected if matching reference and memory cell structures cannot be found.
Keywords :
capacitance measurement; random-access storage; reference circuits; transistors; back-bias capacitance coupling coefficient measurement; current-voltage measurements; figure of merit; floating-gate nonvolatile memory cells; gate capacitance coefficient; gate coupling coefficient extraction methods; nonmatching reference transistors; Capacitance measurement; Current measurement; Dielectrics; Digital audio players; Digital cameras; Electronics industry; Nonvolatile memory; Solid state circuits; Universal Serial Bus; Voltage control; Body effect; capacitive coupling coefficient; nonvolatile memory (NVM) devices;
Journal_Title :
Electron Devices, IEEE Transactions on
DOI :
10.1109/TED.2010.2045669