DocumentCode :
1469498
Title :
Failure mechanism of avalanche photodiodes in the presence of water vapor
Author :
Comizzoli, R.B. ; Osenbach, J.W. ; Crane, G.R. ; Peins, G.A. ; Siconolfi, D.J. ; Lorimor, O.G. ; Chang, C.C.
Author_Institution :
Lucent Technol. Bell Labs., Murray Hill, NJ, USA
Volume :
19
Issue :
2
fYear :
2001
fDate :
2/1/2001 12:00:00 AM
Firstpage :
252
Lastpage :
265
Abstract :
Lower cost optoelectronic modules (transmitters and receivers) could be produced if components could operate reliably in a nonhermetic package. Experiments (operation in humid ambient as a function of temperature, relative humidity (RH), and voltage) were carried out on InP-based avalanche photodiodes (APDs). The objectives were to reveal any moisture-related failure modes, to understand the failure mechanisms, to determine the relevant acceleration factors, and to propose design or material modifications to prevent the failures. Leakage current vs. time was measured for nine cells of 20 devices each. All devices were examined by optical microscopy, and representative samples were studied by scanning electron microscopy. A failure mechanism related to corrosion of the passivating SiN and the underlying semiconductor was identified. Based on the voltage and RH dependence of the degradation rate, a model for the failure process was developed. The mechanism involves RH-dependent transport of charge across the surface of the SiN and Poole-Frenkel current flow through the SiN. This process eventually produces a short circuit
Keywords :
III-V semiconductors; Poole-Frenkel effect; avalanche photodiodes; humidity; indium compounds; leakage currents; life testing; modules; optical microscopy; optical testing; scanning electron microscopy; semiconductor device reliability; semiconductor device testing; InP; InP-based avalanche photodiodes; Poole-Frenkel current flow; SiN; avalanche photodiodes; degradation rate; failure mechanism; failure mechanisms; failure process; leakage current; lower cost optoelectronic modules; moisture-related failure modes; nonhermetic package; optical microscopy; passivating SiN; receivers; relative humidity; reliably; scanning electron microscopy; short circuit; transmitters; water vapor; Avalanche photodiodes; Costs; Failure analysis; Optical microscopy; Optical transmitters; Packaging; Scanning electron microscopy; Silicon compounds; Temperature; Voltage;
fLanguage :
English
Journal_Title :
Lightwave Technology, Journal of
Publisher :
ieee
ISSN :
0733-8724
Type :
jour
DOI :
10.1109/50.917897
Filename :
917897
Link To Document :
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