Title :
A new fabrication process for planar thin-film multijunction thermal converters
Author :
Wunsch, Thomas F. ; Kinard, Joseph R. ; Manginell, Ronald P. ; Solomon, Otis M. ; Lipe, Thomas E. ; Jungling, K.C.
Author_Institution :
Sandia Nat. Labs., Albuquerque, NM, USA
fDate :
4/1/2001 12:00:00 AM
Abstract :
Advanced thin-film processing and packaging technologies are employed in the fabrication of new planar thin-film multijunction thermal converters (MJTCs). The processing, packaging, and design features build on experience gained from prior NIST demonstrations of thin-film converters and are optimized for improved sensitivity, bandwidth, manufacturability, and reliability
Keywords :
etching; semiconductor device packaging; thermocouples; transfer standards; NIST demonstrations; bandwidth; design features; fabrication process; manufacturability; packaging technologies; planar thin-film multijunction thermal converters; reliability; sensitivity; Biomembranes; Design optimization; Dielectric thin films; Fabrication; Gold; NIST; Packaging; Silicon; Sputtering; Transistors;
Journal_Title :
Instrumentation and Measurement, IEEE Transactions on
