DocumentCode
1470832
Title
A new fabrication process for planar thin-film multijunction thermal converters
Author
Wunsch, Thomas F. ; Kinard, Joseph R. ; Manginell, Ronald P. ; Solomon, Otis M. ; Lipe, Thomas E. ; Jungling, K.C.
Author_Institution
Sandia Nat. Labs., Albuquerque, NM, USA
Volume
50
Issue
2
fYear
2001
fDate
4/1/2001 12:00:00 AM
Firstpage
330
Lastpage
332
Abstract
Advanced thin-film processing and packaging technologies are employed in the fabrication of new planar thin-film multijunction thermal converters (MJTCs). The processing, packaging, and design features build on experience gained from prior NIST demonstrations of thin-film converters and are optimized for improved sensitivity, bandwidth, manufacturability, and reliability
Keywords
etching; semiconductor device packaging; thermocouples; transfer standards; NIST demonstrations; bandwidth; design features; fabrication process; manufacturability; packaging technologies; planar thin-film multijunction thermal converters; reliability; sensitivity; Biomembranes; Design optimization; Dielectric thin films; Fabrication; Gold; NIST; Packaging; Silicon; Sputtering; Transistors;
fLanguage
English
Journal_Title
Instrumentation and Measurement, IEEE Transactions on
Publisher
ieee
ISSN
0018-9456
Type
jour
DOI
10.1109/19.918134
Filename
918134
Link To Document