DocumentCode :
1471493
Title :
Fabless-foundry partnership: models and analysis of coordination issues
Author :
Chatterjee, Arun ; Gudmundsson, Dadi ; Nurani, Raman K. ; Seshadri, Sridhar ; Shanthikumar, J. George
Author_Institution :
KLA-Tencor Corp., San Jose, CA, USA
Volume :
12
Issue :
1
fYear :
1999
fDate :
2/1/1999 12:00:00 AM
Firstpage :
44
Lastpage :
52
Abstract :
The fabless-foundry partnership for integrated circuit (IC) manufacturing business is expected to grow from 12% in 1995 to approximately 17% (i.e., $45B) of the total IC market in 2000. The growth of this market will be even more significant for subquarter micron technologies-whose growth is driven by the multimedia industry. The customer base will extend beyond traditional fabless IC companies into vertically integrated IC manufacturers and system vendors. Given the rate of growth and the high technology profile of products, substantial investments in capital, technology, and skilled workforce have to be dedicated and managed effectively for ensuring a successful partnership. In this paper, we outline the potential coordination problems that may arise in such partnerships, and propose a framework for analyzing issues related to yield information sharing and yield improvement. Our analysis indicates that fabless-foundry contracts that are based on a fixed number of good dies, and better yield information are more profitable
Keywords :
VLSI; game theory; integrated circuit manufacture; integrated circuit modelling; coordination issues; fabless-foundry partnership; multimedia industry; skilled workforce; subquarter micron technologies; technology profile; vertically integrated IC manufacture; yield improvement; yield information; Contracts; Demand forecasting; Economic forecasting; Foundries; Information analysis; Integrated circuit manufacture; Integrated circuit modeling; Integrated circuit yield; Investments; Management training;
fLanguage :
English
Journal_Title :
Semiconductor Manufacturing, IEEE Transactions on
Publisher :
ieee
ISSN :
0894-6507
Type :
jour
DOI :
10.1109/66.744521
Filename :
744521
Link To Document :
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