DocumentCode
1471551
Title
Characteristics of p-channel Si nano-crystal memory
Author
Han, Kwangseok ; Kim, Ilgweon ; Shin, Hyungcheol
Author_Institution
Dept. of Electr. Eng. & Comput. Sci., Korea Adv. Inst. of Sci. & Technol., Taejon, South Korea
Volume
48
Issue
5
fYear
2001
fDate
5/1/2001 12:00:00 AM
Firstpage
874
Lastpage
879
Abstract
In this work, the feasibility of p-channel nano-crystal memory with thin oxide in direct tunneling regime is demonstrated. By comparing the programming characteristics of devices with nano-crystals and devices without nano-crystals, the role of dots as storage node is presented. The programming and erasing mechanisms of p-channel nano-crystal memory were investigated by charge separation technique. For small gate programming voltage, hole tunneling component from inversion layer is dominant. However, valence band electron tunneling component from the valence band in the nano-crystal becomes dominant for large gate voltage. In case of erasing, the electron tunneling occurs from either the conduction band or the valence band. Finally, the comparison of retention between programmed holes and electrons shows that holes have longer retention time
Keywords
MOS memory circuits; elemental semiconductors; flash memories; inversion layers; nanotechnology; quantum interference devices; semiconductor quantum dots; silicon; tunnelling; Si; charge separation technique; conduction band; direct tunneling regime; dots role; erasing mechanism; hole retention time; hole tunneling component; inversion layer; large gate voltage; operation characteristics; p-channel nanocrystal memory; programming characteristics; small gate programming voltage; storage node; thin oxide; valence band electron tunneling component; Charge carrier processes; EPROM; Electrons; Helium; MOSFETs; Maintenance; Nanocrystals; Nanoscale devices; Tunneling; Voltage;
fLanguage
English
Journal_Title
Electron Devices, IEEE Transactions on
Publisher
ieee
ISSN
0018-9383
Type
jour
DOI
10.1109/16.918234
Filename
918234
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