Simulation and performance comparison of H-EBG structure with and without vias

A power/ground plane pair is proposed using a novel planar electromagnetic bandgap (EBG) structure for isolating the simultaneously switching noise (SSN) in high-speed circuits. The electromagnetic bandgap (EBG) is widely recognized as a good solution for suppressing the propagation of SSN in the gigahertz range. Each unit cell of the novel EBG is designed by etching slots in a “lH” shape on the power plane while maintaining the ground plane solid. The main advantage of the proposed approach over the commonly practiced methods is the omnidirectional noise suppression the Ground Bounce Noise. Same bandgap level is observed while varying the physical location of the output port. Thus the proposed structure suppressed the Ground Bounce Noise in an omnidirectional manner. By introducing the vias in the H-EBG structures, a substantial improvement in the isolation level at the center frequency. While increasing the number of vias from one to four an improvement in the (-30dB) bandwidth is observed without the compromising isolation level at the center frequency.