DocumentCode :
1472475
Title :
Surface Integral Equation Formulation for Inductance Extraction in 3-D Interconnects
Author :
Al-Qedra, Mohammed ; Aronsson, Jonatan ; Okhmatovski, Vladimir
Author_Institution :
Dept. of Electr. & Comput. Eng., Univ. of Manitoba, Winnipeg, MB, Canada
Volume :
20
Issue :
5
fYear :
2010
fDate :
5/1/2010 12:00:00 AM
Firstpage :
250
Lastpage :
252
Abstract :
A novel surface integral equation based algorithm is proposed for accurate inductance and resistance extraction in 3-D interconnects. The surface integral equation is obtained by using the skin-effect cross-sectional approximation of the volumetric current density in the traditional volumetric integral equation. The method allows for substantial reduction of computational complexity in the pertinent boundary-element formulation compared with widely adopted volumetric models. For a fixed number of samples per skin-depth establishing a desired accuracy of extraction, the number of degrees of freedom in the proposed discretized problem scales with frequency ?? as O(????), as opposed to O(??) exhibited by the volumetric models. The accuracy of extraction is shown to be maintained from dc to the limit of magneto-quasistatic approximation.
Keywords :
boundary-elements methods; current density; integral equations; interconnections; lumped parameter networks; 3D interconnects; adopted volumetric models; boundary-element formulation; computational complexity; discretized problem scales; inductance extraction; magneto-quasistatic approximation; resistance extraction; skin depth; skin-effect cross-sectional approximation; surface integral equation based algorithm; surface integral equation formulation; volumetric current density; volumetric integral equation; Conductor; magneto-quasistatics; resistance/inductance (RL) extraction; skin-effect; surface impedance;
fLanguage :
English
Journal_Title :
Microwave and Wireless Components Letters, IEEE
Publisher :
ieee
ISSN :
1531-1309
Type :
jour
DOI :
10.1109/LMWC.2010.2045577
Filename :
5447710
Link To Document :
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