Title :
The Optimal Air Gap Between the Pancake Windings in a HTS Magnet Consisting of Insert and Outsert Magnet
Author :
Kang, Myunghun ; Ku, Myunghwan ; Lee, Heejoon ; Cha, Gueesoo ; Choi, Kwansun
Author_Institution :
Dept. of Electr. Eng., Soonchunhyang Univ., Asan, South Korea
fDate :
6/1/2010 12:00:00 AM
Abstract :
In a high temperature superconducting magnet consisting of pancake windings, the perpendicular magnetic field considerably reduces the value of the critical current of the outer pancake windings due to anisotropy. An air gap was inserted between each pancake winding in this paper to reduce the decrement of the critical current in each pancake winding. In a low temperature superconducting magnet, the central magnetic field decreases when there is an air gap between the pancake windings. On the other hand, the central magnetic field of a HTS magnet increases when an air gap is provided. The properties of the HTS insert/outsert magnet having an air gap between the pancake windings are examined in this paper. YBCO wire and BSCCO wire were used in the insert and the outsert magnets, respectively. An E - J relation and the evolution strategy were adopted to calculate the optimum critical currents of both magnets. The calculation results showed that there was an optimum air gap which maximized the central magnetic field. The optimum air gap was dependent on the specifications of the HTS magnet.
Keywords :
air gaps; barium compounds; bismuth compounds; calcium compounds; critical currents; high-temperature superconductors; magnetic superconductors; strontium compounds; superconducting magnets; windings; yttrium compounds; BSCCO wire; E-J relation; YBCO wire; YBCO-Bi2Sr2CaCu2O8; anisotropy; central magnetic field; evolution strategy; high temperature superconducting magnet; insert magnet; optimal air gap; optimum critical currents; outer pancake windings; outsert magnet; perpendicular magnetic field; Evolution strategy; insert magnet; outsert magnet; pancake winding;
Journal_Title :
Applied Superconductivity, IEEE Transactions on
DOI :
10.1109/TASC.2010.2044494