DocumentCode
1473457
Title
Temperature dependence of Fowler-Nordheim current in 6H- and 4H-SiC MOS capacitors
Author
Agarwal, Anant K. ; Seshadri, Suresh ; Rowland, Larry B.
Author_Institution
Northrop Grumman Sci. & Technol. Center, Pittsburgh, PA, USA
Volume
18
Issue
12
fYear
1997
Firstpage
592
Lastpage
594
Abstract
This work reports on Fowler-Nordheim (F-N) injection studies on n-type 6H-SiC and 4H-SiC MOS systems under positive gate bias from 25 to 325/spl deg/C. At a given temperature and electric field, the current density in the 4H-SiC MOS system is about five times higher than that in 6H-SiC due to the smaller effective barrier height for the 4H-SiC MOS system as compared to 6H-SiC. The reduction of the effective barrier height with temperature, particularly in 4H-SiC, raises serious concerns about the long-term reliability of gate oxides in SiC. It is concluded that the maximum practical values of electric field in the 4H-SiC MOS system under positive gate bias and high junction temperature should be reduced to below the values used in the Si MOS system.
Keywords
MOS capacitors; current density; power MOSFET; semiconductor device reliability; silicon compounds; tunnelling; wide band gap semiconductors; 25 to 325 C; 4H-SiC MOS capacitors; 6H-SiC MOS capacitors; Fowler-Nordheim current; SiC; current density; effective barrier height; electric field; electron injection; gate oxides; high junction temperature; long-term reliability; positive gate bias; power UMOSFET structure; temperature dependence; Electrons; MOS capacitors; MOS devices; MOSFET circuits; Power MOSFET; Silicon carbide; Temperature dependence; Temperature distribution; Temperature measurement; Voltage;
fLanguage
English
Journal_Title
Electron Device Letters, IEEE
Publisher
ieee
ISSN
0741-3106
Type
jour
DOI
10.1109/55.644081
Filename
644081
Link To Document