DocumentCode :
1473457
Title :
Temperature dependence of Fowler-Nordheim current in 6H- and 4H-SiC MOS capacitors
Author :
Agarwal, Anant K. ; Seshadri, Suresh ; Rowland, Larry B.
Author_Institution :
Northrop Grumman Sci. & Technol. Center, Pittsburgh, PA, USA
Volume :
18
Issue :
12
fYear :
1997
Firstpage :
592
Lastpage :
594
Abstract :
This work reports on Fowler-Nordheim (F-N) injection studies on n-type 6H-SiC and 4H-SiC MOS systems under positive gate bias from 25 to 325/spl deg/C. At a given temperature and electric field, the current density in the 4H-SiC MOS system is about five times higher than that in 6H-SiC due to the smaller effective barrier height for the 4H-SiC MOS system as compared to 6H-SiC. The reduction of the effective barrier height with temperature, particularly in 4H-SiC, raises serious concerns about the long-term reliability of gate oxides in SiC. It is concluded that the maximum practical values of electric field in the 4H-SiC MOS system under positive gate bias and high junction temperature should be reduced to below the values used in the Si MOS system.
Keywords :
MOS capacitors; current density; power MOSFET; semiconductor device reliability; silicon compounds; tunnelling; wide band gap semiconductors; 25 to 325 C; 4H-SiC MOS capacitors; 6H-SiC MOS capacitors; Fowler-Nordheim current; SiC; current density; effective barrier height; electric field; electron injection; gate oxides; high junction temperature; long-term reliability; positive gate bias; power UMOSFET structure; temperature dependence; Electrons; MOS capacitors; MOS devices; MOSFET circuits; Power MOSFET; Silicon carbide; Temperature dependence; Temperature distribution; Temperature measurement; Voltage;
fLanguage :
English
Journal_Title :
Electron Device Letters, IEEE
Publisher :
ieee
ISSN :
0741-3106
Type :
jour
DOI :
10.1109/55.644081
Filename :
644081
Link To Document :
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