DocumentCode :
1473511
Title :
Accurate high speed empirically based predictive modeling of deeply embedded gridded parallel plate capacitors fabricated in a multilayer LTCC process
Author :
Poddar, Ravi ; Brooke, Martin A.
Author_Institution :
Integrated Device Technol. Inc., Duluth, GA, USA
Volume :
22
Issue :
1
fYear :
1999
fDate :
2/1/1999 12:00:00 AM
Firstpage :
26
Lastpage :
31
Abstract :
A novel technique is presented for the accurate, rapid, high frequency, predictive modeling of parallel plate capacitors with gridded plates manufactured in a multilayer low temperature cofired ceramic (LTCC) process. The method is empirical in nature and is based on the concept of incrementally constructing the model for a structure from well characterized individual building blocks. Building blocks are characterized by the use of test structures and measurements, and are modeled using passive lumped circuit elements. This method is applied to the predictive modeling of deeply embedded gridded parallel plate capacitor structures. The procedure has been experimentally verified, with accurate predictions of behavior obtained up to the second self resonance for large area gridded parallel plate capacitors. Since lumped element circuits are generated by this method, structure prediction speed is determined by circuit size and simulator small signal analysis time. The method is versatile and is well suited for circuit design applications
Keywords :
S-parameters; capacitors; ceramic packaging; circuit simulation; circuit size; deeply embedded gridded parallel plate capacitors; low temperature cofired ceramic; multilayer LTCC process; passive lumped circuit element models; predictive modeling; second self resonance; simulator small signal analysis time; Capacitors; Ceramics; Circuit testing; Frequency; Manufacturing processes; Nonhomogeneous media; Predictive models; Resonance; Temperature; Virtual manufacturing;
fLanguage :
English
Journal_Title :
Advanced Packaging, IEEE Transactions on
Publisher :
ieee
ISSN :
1521-3323
Type :
jour
DOI :
10.1109/6040.746539
Filename :
746539
Link To Document :
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