• DocumentCode
    1473511
  • Title

    Accurate high speed empirically based predictive modeling of deeply embedded gridded parallel plate capacitors fabricated in a multilayer LTCC process

  • Author

    Poddar, Ravi ; Brooke, Martin A.

  • Author_Institution
    Integrated Device Technol. Inc., Duluth, GA, USA
  • Volume
    22
  • Issue
    1
  • fYear
    1999
  • fDate
    2/1/1999 12:00:00 AM
  • Firstpage
    26
  • Lastpage
    31
  • Abstract
    A novel technique is presented for the accurate, rapid, high frequency, predictive modeling of parallel plate capacitors with gridded plates manufactured in a multilayer low temperature cofired ceramic (LTCC) process. The method is empirical in nature and is based on the concept of incrementally constructing the model for a structure from well characterized individual building blocks. Building blocks are characterized by the use of test structures and measurements, and are modeled using passive lumped circuit elements. This method is applied to the predictive modeling of deeply embedded gridded parallel plate capacitor structures. The procedure has been experimentally verified, with accurate predictions of behavior obtained up to the second self resonance for large area gridded parallel plate capacitors. Since lumped element circuits are generated by this method, structure prediction speed is determined by circuit size and simulator small signal analysis time. The method is versatile and is well suited for circuit design applications
  • Keywords
    S-parameters; capacitors; ceramic packaging; circuit simulation; circuit size; deeply embedded gridded parallel plate capacitors; low temperature cofired ceramic; multilayer LTCC process; passive lumped circuit element models; predictive modeling; second self resonance; simulator small signal analysis time; Capacitors; Ceramics; Circuit testing; Frequency; Manufacturing processes; Nonhomogeneous media; Predictive models; Resonance; Temperature; Virtual manufacturing;
  • fLanguage
    English
  • Journal_Title
    Advanced Packaging, IEEE Transactions on
  • Publisher
    ieee
  • ISSN
    1521-3323
  • Type

    jour

  • DOI
    10.1109/6040.746539
  • Filename
    746539