Analysis of Magnetic Field and Discharge Plasma for HTS Magnetron Sputtering Apparatus

Author

Qiu, Qingquan ; Xiao, Liye ; Huang, Tianbin ; Zhang, Guomin ; Li, Xiaohang

Author_Institution

Appl. Supercond. Key Lab., Chinese Acad. of Sci., Beijing, China

Volume

20

Issue

3

fYear

2010

fDate

6/1/2010 12:00:00 AM

Firstpage

1017

Lastpage

1020

Abstract

The magnetron sputtering apparatus with high magnetic field could be used to fabricate special films. In order to investigate the typical plasma distribution of high field magnetron and further improve the film quality, a newly HTS (high temperature superconductivity) rectangular planar magnetron with racetrack type coil is proposed. The magnetic field in the discharge space is calculated by finite element method, and it is one order higher than that of conventional magnetrons. Based on this, the simulation of magnetron discharge plasma is performed with PIC-MCC (particle-in-cell, Monte Carlo collision) method. The simulation results show that a large electric field region is formed in high magnetic field. Due to the additional electric field, the plasma is broadened to anode direction. Through theoretical analysis, magnetic field and plasma simulation, the disadvantages of current HTS magnetron are further pointed out, and it is discussed how to improve the HTS magnetron.

Keywords

discharges (electric); plasma density; plasma magnetohydrodynamics; plasma materials processing; plasma simulation; plasma transport processes; sputtering; superconducting coils; HTS; discharge plasma; finite element method; high temperature superconductivity; magnetron sputtering apparatus; rectangular planar magnetron; Coating; high temperature superconductivity; magnetic field; magnetron sputtering; plasma;

fLanguage

English

Journal_Title

Applied Superconductivity, IEEE Transactions on

Publisher

ieee

ISSN

1051-8223

Type

jour

DOI

10.1109/TASC.2010.2044567

Filename

5451076