• DocumentCode
    1474810
  • Title

    Mapping and repairing embedded-memory defects

  • Author

    Youngs, Lynn ; Paramanandam, Siva

  • Author_Institution
    Texas Instrum. Inc., Stafford, TX, USA
  • Volume
    14
  • Issue
    1
  • fYear
    1997
  • Firstpage
    18
  • Lastpage
    24
  • Abstract
    Yield is perhaps the single most important measure of manufacturing efficiency for large integrated circuits. To reduce the time to volume production and accelerate continuous yield improvement, the manufacturing flow of the UltraSparc microprocessor includes memory test as well as defect mapping and repair
  • Keywords
    computer testing; integrated circuit testing; integrated circuit yield; memory architecture; microprocessor chips; UltraSparc microprocessor; continuous yield improvement; defect mapping; embedded memory defects; large integrated circuits; manufacturing efficiency; manufacturing flow; memory test; Circuit faults; Circuit testing; Integrated circuit yield; Logic testing; Manufacturing; Microprocessors; Production; Random access memory; Read-write memory; Yield estimation;
  • fLanguage
    English
  • Journal_Title
    Design & Test of Computers, IEEE
  • Publisher
    ieee
  • ISSN
    0740-7475
  • Type

    jour

  • DOI
    10.1109/54.573354
  • Filename
    573354
    • Link To Document
    https://search.isc.ac/dl/search/defaultta.aspx?DTC=49&DC=1474810