Title :
Demonstration of chip-to-chip propagation of single flux quantum pulses
Author :
Maezawa, Masaaki ; Yamamori, Hirotake ; Shoji, Akira
Author_Institution :
Electrotech. Lab., Ibaraki, Japan
fDate :
3/1/2001 12:00:00 AM
Abstract :
We report experimental results on chip-to-chip transfer of single-flux-quantum (SFQ) pulses using an active multichip module (MCM). Josephson transmitters and receivers are integrated on both a chip and an MCM substrate. An MCM consisting of a 4.8-mm chip and an 8.2-mm MCM substrate was fabricated using a 1.6-kA/cm2 Nb-trilayer process and a solder-bumped flip-chip bonding technology. The correct operation of the circuit was confirmed by low-speed testing. Bit-error rate (BER) of the circuit was measured down to 10-5, and extrapolation of the error-function fits suggested a very small BER, lower than 10-200, at the optimum bias point. Experimental margins on the bias voltage were as large as ±34%
Keywords :
flip-chip devices; multichip modules; superconducting logic circuits; 4.8 mm; 8.2 mm; Josephson receivers; Josephson transmitters; MCM substrate; Nb-AlO-Nb; Nb-trilayer process; active multichip module; bias voltage; bit-error rate; chip-to-chip propagation; error-function; low-speed testing; single flux quantum pulses; solder-bumped flip-chip bonding technology; Bit error rate; Bonding; Broadband communication; Circuit testing; Connectors; Inductance; Multichip modules; Power transmission lines; Transmitters; Voltage;
Journal_Title :
Applied Superconductivity, IEEE Transactions on