DocumentCode
1475558
Title
A Fully SiP Integrated 
-Band Butler Matrix End-Fire Beam-Switching Transmitter Using Flip-Chip Assembled CMOS Chips on LTCC
Author
Kuo, Che-Chung ; Lu, Hsin-Chia ; Lin, Po-An ; Tai, Chen-Fang ; Hsin, Yue-Ming ; Wang, Huei
Author_Institution
Dept. of the Electr. Eng., Nat. Taiwan Univ., Taipei, Taiwan
Volume
60
Issue
5
fYear
2012
fDate
5/1/2012 12:00:00 AM
Firstpage
1424
Lastpage
1436
Abstract
In this paper, a fully system-in-package (SiP) integrated V-band Butler matrix beam-switching transmitter (TX) is presented. The CMOS chips from differential process technologies are assembled on a low-temperature co-fired ceramic (LTCC) substrate carrier by flip-chip interconnects. The vertically embedded folded monopole antenna is designed and integrated into the LTCC. The array consisting of four identical monopole antennas and a Butler matrix for beam switching is realized on the LTCC for loss reduction. Four switched main beams are measured and agree well with simulation. This beam-forming TX shows the potential of the low-cost millimeter-wave SiP with CMOS chips.
Keywords
CMOS integrated circuits; ceramic packaging; flip-chip devices; integrated circuit interconnections; monopole antennas; system-in-package; LTCC substrate carrier; differential process technologies; flip-chip assembled CMOS chips; flip-chip interconnects; fully SiP integrated V-band Butler matrix end-fire beam-switching transmitter; low-temperature co-fired ceramic; system-in-package; vertically embedded folded monopole antenna; Arrays; Butler matrix; CMOS integrated circuits; Dipole antennas; Substrates; $V$
fLanguage
English
Journal_Title
Microwave Theory and Techniques, IEEE Transactions on
Publisher
ieee
ISSN
0018-9480
Type
jour
DOI
10.1109/TMTT.2012.2187795
Filename
6172540
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