DocumentCode :
1476244
Title :
Vibration Transmission Analysis on a Superconducting Seismic Isolation Device With PM and Copper Plate Systems
Author :
Sasaki, S. ; Shimada, K. ; Katana, T. ; Miyagi, D. ; Tsuda, Makoto ; Hamajima, T. ; Kawai, N. ; Yasui, K.
Author_Institution :
Dept. of Electr. Eng., Tohoku Univ., Sendai, Japan
Volume :
22
Issue :
3
fYear :
2012
fDate :
6/1/2012 12:00:00 AM
Firstpage :
3600804
Lastpage :
3600804
Abstract :
We have devised a magnetic levitation type superconducting seismic isolation device using pinning effect of HTS bulk and investigated the characteristics of vibration transmission and damping in a model device with two types of permanent magnet (PM) systems with copper plates; the one was for stable stationary levitation named “PM-PM system” and the other was for improving damping effect named “vibration absorbing system (VAS)”. To clarify the electromagnetic behaviors of these systems, we calculated the distributions of eddy current and magnetic force within the copper plates during a horizontal vibration using a numerical simulation code based on the three-dimensional finite element method (3D-FEM) analysis. As the results, the vibration transmission was reduced due to the Lorenz force generated in the copper plate.
Keywords :
copper; damping; eddy currents; finite element analysis; magnetic forces; magnetic levitation; permanent magnets; superconducting devices; vibration isolation; 3D-FEM analysis; HTS bulk; Lorenz force; PM-PM system; copper plate systems; damping effect; eddy current distributions; electromagnetic behaviors; magnetic force; magnetic levitation; numerical simulation code; permanent magnet systems; superconducting seismic isolation devices; three-dimensional finite element method analysis; vibration absorbing system; vibration transmission analysis; Damping effect; HTS bulk; seismic isolation device; vibration transmission;
fLanguage :
English
Journal_Title :
Applied Superconductivity, IEEE Transactions on
Publisher :
ieee
ISSN :
1051-8223
Type :
jour
DOI :
10.1109/TASC.2012.2186429
Filename :
6172655
Link To Document :
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