Title :
Modelling of orientation relations in 2-D percolative systems of buffered metallic substrates for coated conductors
Author :
Rutter, Noel A. ; Glowacki, Bartek A.
Author_Institution :
Dept. of Mater. Sci. & Metall., Cambridge Univ., UK
fDate :
3/1/2001 12:00:00 AM
Abstract :
The crystallographic alignment of various layers of high Tc coated conductors has been studied in detail using X-Ray Diffraction (XRD) and Electron BackScatter Diffraction (EBSD). Several possible configurations of buffer layers on NiFe substrates are considered, including metallic buffers (Pd/Ag) and native oxides (NiFe 2O4) as well as the more widely studied ceramic buffer route(CeO2/YSZ). The surface texture data (EBSD) was compared with bulk texture measurements (XRD) in order to assess the relationship between them. The percolative properties of the grain structure were investigated using a two dimensional hexagonal grain model, which considers both in-plane and out-of-plane grain boundary misorientations. The model was extended to consider critical currents of macroscopic samples. Factors which affect the percolative nature of current flow in superconducting coated conductors, such as grain size and tape dimensions, have also been studied
Keywords :
X-ray diffraction; crystal microstructure; electron backscattering; grain boundaries; grain size; high-temperature superconductors; percolation; substrates; superconducting thin films; texture; 2-D percolative systems; CeO2-Y2O3ZrO2; Electron BackScatter Diffraction; NiFe2O4; Pd-Ag; X-Ray Diffraction; buffered metallic substrates; ceramic buffer; coated conductors; critical currents; grain boundary misorientations; grain size; grain structure; high temperature superconductor; metallic buffers; native oxides; orientation relations; surface texture data; tape dimensions; two dimensional hexagonal grain model; Backscatter; Buffer layers; Ceramics; Conductors; Crystallography; Electrons; Grain boundaries; Surface texture; X-ray diffraction; X-ray scattering;
Journal_Title :
Applied Superconductivity, IEEE Transactions on
