YBaCuO deposition by MOCVD on metallic substrates: a comparative study on buffer layers

Author

Jimenez, Carmen ; Weiss, François ; Sénateur, Jean-Pierre ; Abrutis, Adulfas ; Krellmann, Mathias ; Selbmann, Dietmar ; Eickemeyer, Joerg ; Stadel, Oliver ; Wahl, George

Author_Institution

Lab. des Mater. et du Genie Phys., Saint Martin d´´Heres, France

Volume

11

Issue

1

fYear

2001

fDate

3/1/2001 12:00:00 AM

Firstpage

2905

Lastpage

2908

Abstract

YBaCuO films of about 1 μm thickness have been deposited by metal organic chemical vapor deposition (MOCVD) on biaxially textured Ni-based substrates. Different buffer layers (MgO, YSZ, CeO₂), and also NiO epitaxially grown on Ni, have been tested with subsequent YBCO deposition in the same reactor. When using NiO as first buffer layer, Ni-based substrates were oxidized in a rapid thermal processing system or in a conventional furnace previous to deposition of the second buffer layer. In the present work, we study different conductor architectures from the point of view of T_c, J_c (77K), epitaxial growth, and chemical stability of the structure

Keywords

MOCVD; barium compounds; critical current density (superconductivity); high-temperature superconductors; rapid thermal processing; superconducting epitaxial layers; superconducting transition temperature; vapour phase epitaxial growth; yttrium compounds; 1 mum; CeO₂; HTSC; MOCVD; MgO; Ni; NiO; Y₂O₃ZrO₂; YBaCuO; YBaCuO deposition; biaxially textured Ni-based substrates; buffer layers; chemical stability; conductor architectures; critical current density; epitaxial growth; metal organic chemical vapor deposition; metallic substrates; rapid thermal processing system; surface oxidation epitaxy; transition temperature; Buffer layers; Chemical vapor deposition; Furnaces; Inductors; MOCVD; Organic chemicals; Rapid thermal processing; Substrates; Testing; Yttrium barium copper oxide;

fLanguage

English

Journal_Title

Applied Superconductivity, IEEE Transactions on

Publisher

ieee

ISSN

1051-8223

Type

jour

DOI

10.1109/77.919670

Filename

919670