Title :
Grain boundary misorientation and thermal grooving in cube-textured Ni and Ni-Cr tape
Author :
Gladstone, T.A. ; Moore, J.C. ; Wilkinson, A.J. ; Grovenor, C.R.M.
Author_Institution :
Dept. of Mater., Oxford Univ., UK
fDate :
3/1/2001 12:00:00 AM
Abstract :
AFM and EBSD characterization has been carried out to measure the degree of grain boundary grooving in cube-textured Ni and Ni-10wt%Cr substrates. Low angle grain boundary grooves are found to be consistently shallower than grooves at high angle boundaries. Our results suggest that the recrystallization of pure Ni substrates in a Ar-H2 atmosphere rather than vacuum may be beneficial in minimizing groove depth. Grain boundary grooves in Ni-10wt%Cr tape were found to be deeper than in pure Ni, consistent with the higher temperature used for recrystallization
Keywords :
atomic force microscopy; chromium alloys; electron backscattering; electron diffraction; grain boundaries; nickel; nickel alloys; recrystallisation; recrystallisation texture; substrates; surface topography; AFM; Ar-H2 atmosphere; EBSD; HTSC substrates; Ni; Ni-Cr; characterization; cube-textured Ni tape; cube-textured Ni-Cr tape; electron backscattered diffraction; grain boundary grooving; grain boundary misorientation; groove depth; recrystallization; thermal grooving; Buffer layers; Etching; Grain boundaries; Substrates; Superconducting epitaxial layers; Superconducting films; Superconducting materials; Surface texture; Telephony; Temperature;
Journal_Title :
Applied Superconductivity, IEEE Transactions on
