Grain boundary misorientation and thermal grooving in cube-textured Ni and Ni-Cr tape

Author

Gladstone, T.A. ; Moore, J.C. ; Wilkinson, A.J. ; Grovenor, C.R.M.

Author_Institution

Dept. of Mater., Oxford Univ., UK

Volume

11

Issue

1

fYear

2001

fDate

3/1/2001 12:00:00 AM

Firstpage

2923

Lastpage

2926

Abstract

AFM and EBSD characterization has been carried out to measure the degree of grain boundary grooving in cube-textured Ni and Ni-10wt%Cr substrates. Low angle grain boundary grooves are found to be consistently shallower than grooves at high angle boundaries. Our results suggest that the recrystallization of pure Ni substrates in a Ar-H₂ atmosphere rather than vacuum may be beneficial in minimizing groove depth. Grain boundary grooves in Ni-10wt%Cr tape were found to be deeper than in pure Ni, consistent with the higher temperature used for recrystallization

Keywords

atomic force microscopy; chromium alloys; electron backscattering; electron diffraction; grain boundaries; nickel; nickel alloys; recrystallisation; recrystallisation texture; substrates; surface topography; AFM; Ar-H₂ atmosphere; EBSD; HTSC substrates; Ni; Ni-Cr; characterization; cube-textured Ni tape; cube-textured Ni-Cr tape; electron backscattered diffraction; grain boundary grooving; grain boundary misorientation; groove depth; recrystallization; thermal grooving; Buffer layers; Etching; Grain boundaries; Substrates; Superconducting epitaxial layers; Superconducting films; Superconducting materials; Surface texture; Telephony; Temperature;

fLanguage

English

Journal_Title

Applied Superconductivity, IEEE Transactions on

Publisher

ieee

ISSN

1051-8223

Type

jour

DOI

10.1109/77.919674

Filename

919674