• DocumentCode
    1477188
  • Title

    Ex-situ post-deposition processing for large area Y1Ba 2Cu3O7 films and coated tapes

  • Author

    Solovyov, Vyacheslav F. ; Wiesmann, Harold J. ; Wu, Li-Jun ; Zhu, Yimei ; Suenaga, Masaki

  • Author_Institution
    Dept. of Appl. Sci., Brookhaven Nat. Lab., Upton, NY, USA
  • Volume
    11
  • Issue
    1
  • fYear
    2001
  • fDate
    3/1/2001 12:00:00 AM
  • Firstpage
    2939
  • Lastpage
    2942
  • Abstract
    Ex-situ post-deposition reaction processing is considered a promising alternative to in-situ physical vapor deposition techniques for coated Y1Ba2Cu3O7 conductor development. It was reported recently that attempts at ex-situ processing of long Y1Ba2Cu3O7 precursor tapes resulted in an inhomogeneous growth rate over the tape length and rather poor properties for the whole sample. We performed a set of experiments in order to clarify the mechanisms for the ex-situ processing of large area films and estimate properties of long coated conductors manufactured by the ex-situ technique. It was found that rate limiting step of ex-situ growth of Y1Ba2Cu3O7 is removal of the reaction product, hydrofluoric acid, by both gas diffusion and convection in the reaction atmosphere. We report on a quantitative model that well describes the observed growth rates for films with various areas
  • Keywords
    barium compounds; heat treatment; high-temperature superconductors; superconducting tapes; surface chemistry; surface diffusion; vacuum deposition; yttrium compounds; Y1Ba2Cu3O7; convection; ex-situ growth; ex-situ post-deposition processing; gas diffusion; growth rate; hydrofluoric acid reaction product removal; large area films; long coated conductors; quantitative model; rate limiting step; reaction atmosphere; Atmosphere; Conductive films; Conductors; Gases; Hafnium; Inductors; Laboratories; Production; Substrates; Yttrium barium copper oxide;
  • fLanguage
    English
  • Journal_Title
    Applied Superconductivity, IEEE Transactions on
  • Publisher
    ieee
  • ISSN
    1051-8223
  • Type

    jour

  • DOI
    10.1109/77.919678
  • Filename
    919678