Title : 
Design of 2
  
 VDD-Tolerant Power-Rail ESD Clamp Circuit With Consideration of Gate Leakage Current in 65-nm CMOS Technology
 
        
            Author : 
Wang, Chang-Tzu ; Ker, Ming-Dou
         
        
            Author_Institution : 
Nanoelectron. & Gigascale Syst. Lab., Nat. Chiao Tung Univ., Hsinchu, Taiwan
         
        
        
        
        
            fDate : 
6/1/2010 12:00:00 AM
         
        
        
        
            Abstract : 
A low-leakage 2× VDD-tolerant power-rail electrostatic discharge (ESD) clamp circuit composed of the silicon-controlled rectifier (SCR) device and new ESD detection circuit, realized with only thin-oxide 1× VDD devices, has been proposed with consideration of gate leakage current. By reducing the voltage across the gate oxides of the devices in the ESD detection circuit, the whole power-rail ESD clamp circuit can achieve an ultralow standby leakage current. The new proposed circuit has successfully been verified in a 1-V 65-nm CMOS process, which can achieve 6.5-kV human-body-model and 350-V machine-model ESD levels under ESD stresses, but only consumes a standby leakage current of 0.15 μA at room temperature under normal circuit operating conditions with 1.8-V bias.
         
        
            Keywords : 
CMOS integrated circuits; electrostatic discharge; leakage currents; rectifiers; CMOS technology; ESD detection circuit; current 0.15 muA; electrostatic discharge; gate leakage current; human-body-model; low-leakage 2× VDD-tolerant power-rail electrostatic discharge clamp circuit; machine-model ESD levels; silicon-controlled rectifier device; size 65 nm; temperature 293 K to 298 K; thin-oxide 1× VDD devices; voltage 1 V; voltage 1.8 V; voltage 350 V; voltage 6.5 V; CMOS process; Circuits; Clamps; Electrostatic discharge; Leak detection; Leakage current; Rectifiers; Stress; Thyristors; Voltage; Electrostatic discharge (ESD); gate leakage; mixed-voltage input/output (I/O); silicon-controlled rectifier (SCR);
         
        
        
            Journal_Title : 
Electron Devices, IEEE Transactions on
         
        
        
        
        
            DOI : 
10.1109/TED.2010.2046457