Title :
Thick film techniques for hybrid integrated microwave circuits
Author :
Funk, W. ; Schilz, W.
Author_Institution :
Philips GmbH, Forschungslaboratorium Hamburg, Hamburg, West Germany
fDate :
9/1/1974 12:00:00 AM
Abstract :
The applicability of thick film technique has been investigated for frequencies above 1 GHz. By usinga special technique (direct metal foil screens) integrated microwave circuits for frequencies up to 10 GHz have been fabricated. The special requirements for microwave thick film circuits are discussed and the electrical and technological properties of three selected microwave circuits are reported in detail.
Keywords :
hybrid integrated circuits; solid-state microwave circuits; thick film circuits; hybrid integrated microwave circuits; thick film techniques;
Journal_Title :
Radio and Electronic Engineer
DOI :
10.1049/ree.1974.0124
