DocumentCode
1477505
Title
Thick film techniques for hybrid integrated microwave circuits
Author
Funk, W. ; Schilz, W.
Author_Institution
Philips GmbH, Forschungslaboratorium Hamburg, Hamburg, West Germany
Volume
44
Issue
9
fYear
1974
fDate
9/1/1974 12:00:00 AM
Firstpage
504
Lastpage
508
Abstract
The applicability of thick film technique has been investigated for frequencies above 1 GHz. By usinga special technique (direct metal foil screens) integrated microwave circuits for frequencies up to 10 GHz have been fabricated. The special requirements for microwave thick film circuits are discussed and the electrical and technological properties of three selected microwave circuits are reported in detail.
Keywords
hybrid integrated circuits; solid-state microwave circuits; thick film circuits; hybrid integrated microwave circuits; thick film techniques;
fLanguage
English
Journal_Title
Radio and Electronic Engineer
Publisher
iet
ISSN
0033-7722
Type
jour
DOI
10.1049/ree.1974.0124
Filename
5268274
Link To Document