Advanced multilayer photoimaged substrate integrated waveguides and RF front-end for emerging mm-wave wireless applications

This paper describes the realization of high performance millimetre-wave substrate integrated waveguide (SIW) components and integrated compact RF front-end modules using photoimaged trench vias on advanced multilayer thick-film technology. Contrary to widely used SIW with fence-post vias, advanced trench-filled vias form continuous metal (silver) side walls, enabling SIW to provide low loss and extending its suitability from microwave to sub-THz applications. The multilayer SIW are studied for different cavity dimensions. The multilayer SIW components demonstrates high performance, superior to the reported results from most of the module/system integration technologies. Furthermore, using trench-via based integration technique, a highly compact RF front-end was realized on a single substrate integrating SIW components with MMICs and other passives.