Underfill Selection, Characterization, and Reliability Study for Fine-Pitch, Large Die Cu/Low-K Flip Chip Package

Author

Ong, Yue Ying ; Ho, Soon Wee ; Sekhar, Vasarla Nagendra ; Ong, Xuefen ; Ong, Jimmy ; Zhang, Xiaowu ; Vaidyanathan, Kripesh ; Yoon, Seung Uk ; Lau, John H. ; Kheng, Lim Yeow ; Yeo, David ; Chan, Kai Chong ; Zhang, Yanfeng ; Tan, Juan Boon ; Sohn, Dong Kyun

Author_Institution

Inst. of Microelectron., Singapore, Singapore

Volume

1

Issue

3

fYear

2011

fDate

3/1/2011 12:00:00 AM

Firstpage

279

Lastpage

290

Abstract

This paper presents a systematic underfill selection and characterization methods for 21 ×21 mm² Cu/low-K flip chip packages (65 nm technology) with 150 μm bump pitch. This paper has also correlated the underfill characterization methods with the reliability results of 15×15 mm² and 21×21 mm² Cu/low-K flip chip packages. From the validations of underfill selection and characterization approach with the reliability of 21×21 mm² Cu/low-K flip chip package, it was found that the reliability results correlated well with the adhesion test results. Underfill/flux compatibility and underfill flow performance are found to be important factors during underfill selection. Underfill should not be sieved out at the initial stage without actual reliability tests.

Keywords

copper; flip-chip devices; integrated circuit reliability; Cu; adhesion test results; bump pitch; copper-low-k flip chip package reliability; size 150 mum; size 65 nm; underfill characterization methods; underfill selection methods; underfill-flux compatibility; Adhesives; Copper; Finite element methods; Glass; Reliability; Substrates; Cu/low-K packaging; fine pitch; large die; reliability; underfill selection and characterization;

fLanguage

English

Journal_Title

Components, Packaging and Manufacturing Technology, IEEE Transactions on

Publisher

ieee

ISSN

2156-3950

Type

jour

DOI

10.1109/TCPMT.2010.2100433

Filename

5737776