A 3-chamber deposition system for the simultaneous double-sided coating of 5-inch wafers

Author

Geerk, J. ; Zaitsev, A. ; Linker, G. ; Aidam, R. ; Schneider, R. ; Ratzel, F. ; Fromknecht, R. ; Scheerer, B. ; Reiner, H. ; Gagnidze, E. ; Schwab, R.

Author_Institution

Inst. fur Festkorperphysik, Forschungszentrum Karlsruhe, Germany

Volume

11

Issue

1

fYear

2001

fDate

3/1/2001 12:00:00 AM

Firstpage

3856

Lastpage

3858

Abstract

We describe a sputtering system which allows the simultaneous deposition of HTS films on both sides of wafers up to 5-inch diameter. The system consists of three deposition chambers in a row to cover a wafer on both sides simultaneously with three different films, such as a buffer layer, a HTS film and a contact layer. We present data on the performance of the system, such as temperature homogeneity at the substrate location, the lateral distribution in film thickness and composition, and the properties of the deposited HTS films, on which we measured the critical current density, the field dependence of the surface resistance and the performance of stripline and disk resonators and filters

Keywords

barium compounds; critical current density (superconductivity); high-temperature superconductors; sputter deposition; strip line filters; strip line resonators; superconducting microwave devices; superconducting resonators; superconducting thin films; surface conductivity; yttrium compounds; 3-chamber deposition system; 5-inch wafers; YBaCuO; contact layer; critical current density; disk resonators; film composition; film thickness; filters; simultaneous double-sided coating; sputtering; stripline; surface resistance; temperature homogeneity; Buffer layers; Current measurement; Density measurement; Electrical resistance measurement; High temperature superconductors; Sputtering; Substrates; Surface resistance; Temperature dependence; Temperature distribution;

fLanguage

English

Journal_Title

Applied Superconductivity, IEEE Transactions on

Publisher

ieee

ISSN

1051-8223

Type

jour

DOI

10.1109/77.919906

Filename

919906