DocumentCode :
1479009
Title :
Tracking and erosion of HTV silicone rubber and suppression mechanism of ATH
Author :
Kumagai, S. ; Yoshimura, N.
Author_Institution :
Dept. of Electr. & Electron. Eng., Akita Univ., Japan
Volume :
8
Issue :
2
fYear :
2001
fDate :
4/1/2001 12:00:00 AM
Firstpage :
203
Lastpage :
211
Abstract :
Tracking and erosion of high temperature vulcanizing (HTV)-silicone rubber (SIR) and the suppression mechanism of alumina trihydrate (ATH) filler were investigated in the present study. The tracking and erosion resistance of HTV-SIR filled with 0 to 60%wt ATH was evaluated by employing an IEC 587 inclined plane (IP) tracking and erosion test, during which leakage current pulses on HTV-SIR were counted. Surface temperature distributions and the occurrences of thermal spots >400°C also were observed by means of an infrared thermovision study. We employed thermogravimetry (TG)-differential thermal analysis (DTA)-mass spectrometer (MS) to observe the thermal degradation of unfilled and filled HTV-SIR in both air and argon. The test results indicate that 40%wt is a critical ATH level and whether tracking and erosion is allowed in the IP tracking and erosion test. Highly filling ATH (>40%wt) reduces the number of low unit silicone oligomer precursors which promote dry-band arcing as well as the presence of residual carbon which leads to carbonization. Chemical modifications of water vapor liberated from heated ATH to methyl groups, which occurs at the thermal decomposition temperature of silicone rubber, were found to result in the above process. The protection mechanisms of ATH for the tracking and erosion of HTV-SIR are formulated herein
Keywords :
differential thermal analysis; filled polymers; insulation testing; leakage currents; mass spectrometer applications; silicone rubber; surface discharges; vulcanisation; wear testing; ATH; HTV silicone rubber; IEC 587 inclined plane test; carbonization; dry-band arcing; erosion; high temperature vulcanization; infrared thermovision study; leakage current; mass spectrometer; protection mechanisms; silicone oligomer precursors; suppression mechanism; surface temperature distributions; thermal decomposition temperature; thermal spots; thermogravimetry-differential thermal analysis; tracking; Argon; Filling; IEC standards; Leakage current; Rubber; Spectroscopy; Surface resistance; Temperature distribution; Testing; Thermal degradation;
fLanguage :
English
Journal_Title :
Dielectrics and Electrical Insulation, IEEE Transactions on
Publisher :
ieee
ISSN :
1070-9878
Type :
jour
DOI :
10.1109/94.919930
Filename :
919930
Link To Document :
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