DocumentCode :
1479517
Title :
Development and Application of a Novel Microfabricated Device for the In Situ Tensile Testing of 1-D Nanomaterials
Author :
Ganesan, Yogeeswaran ; Lu, Yang ; Peng, Cheng ; Lu, Hao ; Ballarini, Roberto ; Lou, Jun
Author_Institution :
Dept. of Mech. Eng. & Mater. Sci., Rice Univ., Houston, TX, USA
Volume :
19
Issue :
3
fYear :
2010
fDate :
6/1/2010 12:00:00 AM
Firstpage :
675
Lastpage :
682
Abstract :
We report on the development and application of a silicon microdevice for the in situ quantitative mechanical characterization of single 1-D nanomaterials within a scanning electron microscope equipped with a quantitative nanoindenter. The design makes it possible to convert a compressive nanoindentation force applied to a shuttle to uniaxial tension on a specimen attached to a sample stage. Finite-element analysis and experimental calibration have been employed to extract the specimen stress versus strain curve from the indentation load versus displacement curve. The stress versus strain curves for three 200-300-nm-diameter Ni nanowire specimens are presented and analyzed.
Keywords :
Young\´s modulus; elemental semiconductors; finite element analysis; micromechanical devices; nanoindentation; nanowires; nickel; scanning electron microscopy; silicon; stress-strain relations; tensile strength; tensile testing; 1D nanomaterials; Ni; Ni nanowire; Si; compressive nanoindentation force; experimental calibration; finite-element analysis; in situ quantitative mechanical characterization; in situ tensile testing; scanning electron microscopy; silicon microdevice; size 200 nm to 300 nm; stress versus strain curve; uniaxial tension; In situ; microdevices; nanoindenter; nanomanipulation; nanomechanics;
fLanguage :
English
Journal_Title :
Microelectromechanical Systems, Journal of
Publisher :
ieee
ISSN :
1057-7157
Type :
jour
DOI :
10.1109/JMEMS.2010.2046014
Filename :
5454377
Link To Document :
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