DocumentCode
1479765
Title
A QoS-Enabled On-Die Interconnect Fabric for Kilo-Node Chips
Author
Grot, Boris ; Hestness, Joel ; Keckler, Stephen W. ; Mutlu, Onur
Author_Institution
Ecole Polytech. Fed. de Lausanne, Lausanne, Switzerland
Volume
32
Issue
3
fYear
2012
Firstpage
17
Lastpage
25
Abstract
To meet rapidly growing performance demands and energy constraints, future chips will likely feature thousands of on-die resources. Existing network-on-chip solutions weren´t designed for scalability and will be unable to meet future interconnect demands. A hybrid network-on-chip architecture called Kilo-NoC co-optimizes topology, flow control, and quality of service to achieve significant gains in efficiency.
Keywords
network-on-chip; power aware computing; quality of service; Kilo-NoC cooptimizes topology; QoS enabled on die interconnect fabric; energy constraints; flow control; kilo node chips; network-on-chip; ondie resources; Dies; Energy management; Network topology; Quality of service; Scalability; System recovery; Topology; Kilo-NoC; MECS; flow control; nework on chip; quality of service; scalability;
fLanguage
English
Journal_Title
Micro, IEEE
Publisher
ieee
ISSN
0272-1732
Type
jour
DOI
10.1109/MM.2012.18
Filename
6175881
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