Compact High-Gain mmWave Antenna for TSV-Based System-in-Package Application

Author

Hu, Sanming ; Xiong, Yong-Zhong ; Wang, Lei ; Li, Rui ; Shi, Jinglin ; Lim, Teck-Guan

Author_Institution

Inst. of Microelectron., Agency for Sci., Technol. & Res. (A*STAR), Singapore, Singapore

Volume

2

Issue

5

fYear

2012

fDate

5/1/2012 12:00:00 AM

Firstpage

841

Lastpage

846

Abstract

This paper presents a cavity-backed slot (CBS) antenna for millimeter-wave applications. The cavity of the antenna is fully filled by polymer material. This filling makes the fabrication of a silicon CBS antenna feasible, reduces the cavity size by 76.8%, and also maintains the inherent high-gain and wide bandwidth. In addition, a through-silicon via-based architecture is proposed to integrate the 135-GHz CBS antenna with active circuits for a complete system-in-package. Results show that the proposed structure not only reduces the footprint size but also suppresses the electromagnetic interference.

Keywords

active networks; interference suppression; millimetre wave antennas; polymers; slot antennas; system-in-package; three-dimensional integrated circuits; TSV-based system-in-package application; active circuit; cavity size; cavity-backed slot antenna; compact high-gain mmwave antenna; electromagnetic interference suppression; frequency 135 GHz; millimeter-wave application; polymer material; silicon CBS antenna fabrication; through-silicon via-based architecture; Antenna measurements; Cavity resonators; Frequency measurement; Gain; Horn antennas; Polymers; Cavity-backed slot (CBS) antenna; electromagnetic interference (EMI); millimeter-wave (mmWave); system-in-package (SiP); through-silicon via (TSV);

fLanguage

English

Journal_Title

Components, Packaging and Manufacturing Technology, IEEE Transactions on

Publisher

ieee

ISSN

2156-3950

Type

jour

DOI

10.1109/TCPMT.2012.2188293

Filename

6175932