• DocumentCode
    1480235
  • Title

    Low Thermal Impedance of Substrate-Free Metal Cavity Surface-Emitting Microlasers

  • Author

    Lu, Chien-Yao ; Chang, Shu-Wei ; Chuang, Shun Lien ; Germann, Tim D. ; Pohl, Udo W. ; Bimberg, Dieter

  • Author_Institution
    Dept. of Electr. & Comput. Eng., Univ. of Illinois at Urbana-Champaign, Urbana, IL, USA
  • Volume
    23
  • Issue
    15
  • fYear
    2011
  • Firstpage
    1031
  • Lastpage
    1033
  • Abstract
    The thermal impedance of a substrate-free metal cavity surface-emitting microlaser is measured. The lasing wavelength shifts with temperature at a ratio of 4.367 × 10-2 nm/°C. An extremely low thermal impedance below 1.730°C/mW is extracted for this microlaser with a 1.0-μm radius and 3.5-μm height in the temperature window of 20°C -80°C. The full metal coverage, substrate-free configuration, and metal bonding lead to efficient heat removal.
  • Keywords
    surface emitting lasers; metal bonding; size 1.0 mum; size 3.5 mum; substrate-free configuration; substrate-free metal cavity surface-emitting microlasers; temperature 20 C to 80 C; thermal impedance; Cavity resonators; Heating; Impedance; Metals; Substrates; Temperature measurement; Vertical cavity surface emitting lasers; Heatsinks; metal cavities; semiconductor lasers; thermal impedance; thermal management; vertical-cavity surface-emitting lasers;
  • fLanguage
    English
  • Journal_Title
    Photonics Technology Letters, IEEE
  • Publisher
    ieee
  • ISSN
    1041-1135
  • Type

    jour

  • DOI
    10.1109/LPT.2011.2132124
  • Filename
    5738663