Title :
A Fully Differential CMOS–MEMS DETF Oxide Resonator With
and Positive TCF
Author :
Chen, Wen-Chien ; Li, Ming-Huang ; Liu, Yu-Chia ; Fang, Weileun ; Li, Sheng-Shian
Author_Institution :
Dept. of Power Mech. Eng., Nat. Tsing Hua Univ., Hsinchu, Taiwan
fDate :
5/1/2012 12:00:00 AM
Abstract :
A fully differential CMOS-MEMS double-ended tuning-fork (DETF) oxide resonator fabricated using a 0.18-μm CMOS process has been demonstrated with a Q greater than 4800 and more-than-20-dB stopband rejection at 10.4 MHz. The key to attaining such a performance attributes to the use of oxide structures with embedded metal electrodes, where SiO2 offers a Q enhancement (at least a 3-times-higher Q) as compared to other CMOS-MEMS-based composite resonators with similar structures and vibrating modes and where flexible electrical routing facilitates fully differential configuration to suppress capacitive feedthroughs. In addition, the resonators developed in this work possess a positive temperature coefficient of frequency (TCf) and mode-splitting capability, therefore indicating a great potential for temperature compensation and spurious-mode suppression, respectively. This technology paves a way to realize fully integrated CMOS-MEMS oscillators and filters which might benefit future single-chip transceivers for wireless communications.
Keywords :
CMOS integrated circuits; band-stop filters; compensation; micromechanical devices; oscillators; resonator filters; CMOS-MEMS DETF oxide resonator; CMOS-MEMS filters; CMOS-MEMS oscillators; SiO2; double-ended tuning-fork; embedded metal electrodes; frequency 10 MHz; mode splitting; oxide structures; positive TCF; single-chip transceivers; size 0.18 mum; stopband rejection; temperature compensation; vibrating modes; CMOS process; Electrodes; Frequency measurement; Metals; Q measurement; Resonant frequency; Temperature measurement; 0.18-$muhbox{m}$ CMOS Process; CMOS–MEMS; double-ended tuning-fork (DETF); embedded electrode; fully differential; micromechanical resonators; oxide structure;
Journal_Title :
Electron Device Letters, IEEE
DOI :
10.1109/LED.2012.2188774