• DocumentCode
    1480990
  • Title

    Thermal behavior of a solid nitrogen impregnated high-temperature superconducting pancake test coil under transient heating

  • Author

    Isogami, Hisashi ; Haid, Benjamin J. ; Iwasa, Yukikazu

  • Author_Institution
    Francis Bitter Nat. Magnet Lab., MIT, Cambridge, MA, USA
  • Volume
    11
  • Issue
    1
  • fYear
    2001
  • fDate
    3/1/2001 12:00:00 AM
  • Firstpage
    1852
  • Lastpage
    1855
  • Abstract
    This paper presents experimental and analytical results on a solid nitrogen impregnated high-temperature superconducting (HTS) test coil under transient heating. The test coil is a 1-layer, 10-turn single-pancake wound with Bi2223/Ag composite tape, 9-mm wide and 0.5-mm thick, with an average winding diameter of 105 mm. The solid nitrogen impregnating the 0.38-mm turn-to-turn radial gaps in the winding enhances the winding´s overall heat capacity significantly in the operating temperature range 30-40 K and thereby limits the test coil´s temperature rise when it is subjected to overcurrent pulses. The presence of solid nitrogen within the winding improves stability against fault-mode overcurrent pulses for HTS magnets used in electric power devices
  • Keywords
    bismuth compounds; calcium compounds; high-temperature superconductors; nitrogen; silver; strontium compounds; superconducting coils; superconducting device testing; superconducting tapes; 0.38 mm; 0.5 mm; 1-layer 10-turn single-pancake coil; 105 mm; 30 to 40 K; 9 mm; Bi2223/Ag composite tape; Bi2Sr2Ca2Cu3O-Ag; N; electric power devices; fault-mode overcurrent pulses; heat capacity; overcurrent pulses; solid nitrogen impregnated HTS coil; stability; superconducting pancake test coil; thermal behavior; transient heating; turn-to-turn radial gaps; Heating; High temperature superconductors; Nitrogen; Solids; Superconducting coils; Superconducting films; Superconducting magnets; Temperature distribution; Testing; Transient analysis;
  • fLanguage
    English
  • Journal_Title
    Applied Superconductivity, IEEE Transactions on
  • Publisher
    ieee
  • ISSN
    1051-8223
  • Type

    jour

  • DOI
    10.1109/77.920209
  • Filename
    920209