DocumentCode :
1481739
Title :
An experimental 1.5-V 64-Mb DRAM
Author :
Nakagome, Yoshinobu ; Tanaka, Hitoshi ; Takeuchi, Kan ; Kume, Eiji ; Watanabe, Yasushi ; Kaga, Toru ; Kawamoto, Yoshifumi ; Murai, Fumio ; Izawa, Ryuichi ; Hisamoto, Digh ; Kisu, Teruaki ; Nishida, Takashi ; Takeda, Eiji ; Itoh, Kiyoo
Author_Institution :
Hitachi Ltd., Tokyo, Japan
Volume :
26
Issue :
4
fYear :
1991
fDate :
4/1/1991 12:00:00 AM
Firstpage :
465
Lastpage :
472
Abstract :
Low-voltage circuit technologies for higher-density dynamic RAMs (DRAMs) and their application to an experimental 64-Mb DRAM with a 1.5-V internal operating voltage are presented. A complementary current sensing scheme is proposed to reduce data transmission delay. A speed improvement of 20 ns was achieved when utilizing a 1.5-V power supply. An accurate and speed-enhanced half-VCC voltage generator with a current-mirror amplifier and tri-state buffer is proposed. With it, a response time reduction of about 1.5 decades was realized. A word-line driver with a charge-pump circuit was developed to achieve a high boost ratio. A ratio of about 1.8 was obtained from a power supply voltage as low as 1.0 V. A 1.28 μm2 crown-shaped stacked-capacitor (CROWN) cell was also made to ensure a sufficient storage charge and to minimize data-line interference noise. An experimental 1.5 V 64 Mb DRAM was designed and fabricated with these technologies and 0.3 μm electron-beam lithography. A typical access time of 70 ns was obtained, and a further reduction of 50 ns is expected based on simulation results. Thus, a high-speed performance, comparable to that of 16-Mb DRAMs, can be achieved with a typical power dissipation of 44 mW, one tenth that of 16-Mb DRAMs. This indicates that a low-voltage battery operation is a promising target for future DRAMs
Keywords :
CMOS integrated circuits; DRAM chips; VLSI; 0.3 micron; 1.5 V; 44 mW; 64 Mbit; 70 ns; CROWN cell; DRAM; LV circuit technologies; charge-pump circuit; complementary current sensing scheme; crown-shaped stacked-capacitor; current-mirror amplifier; dynamic RAMs; electron-beam lithography; low-voltage battery operation; power dissipation; response time reduction; tri-state buffer; triple well CMOS; voltage generator; word-line driver; Charge pumps; DRAM chips; Data communication; Delay; Driver circuits; Interference; Low voltage; Power supplies; Random access memory; Signal to noise ratio;
fLanguage :
English
Journal_Title :
Solid-State Circuits, IEEE Journal of
Publisher :
ieee
ISSN :
0018-9200
Type :
jour
DOI :
10.1109/4.75040
Filename :
75040
Link To Document :
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