Investigation of corrosion behaviour of nanostructured copper thin film produced by radio frequency sputtering

Author

Saremi, Mehrin ; Yeganeh, M.

Author_Institution

Corrosion Lab., Univ. of Tehran, Tehran, Iran

Volume

5

Issue

2

fYear

2010

fDate

4/1/2010 12:00:00 AM

Firstpage

70

Lastpage

75

Abstract

Nanostructured copper was deposited on oxidised p-type (100) single crystal silicon using radio frequency (RF) sputtering technique. The morphology and crystal orientation of the deposited films were examined by scanning electron microscopy (SEM) and X-ray diffraction (XRD), respectively. Corrosion behaviour of these films was studied by potentiodynamic polarisation and electrochemical impedance spectroscopy (EIS) methods. Results showed that the corrosion resistance of copper thin film produced by RF sputtering was higher than the copper sheet because of its higher ability to form a passive layer and protective cuprous oxide on its surface.

Keywords

X-ray diffraction; corrosion resistance; electrochemical impedance spectroscopy; metallic thin films; nanostructured materials; polarisation; scanning electron microscopy; sputter deposition; Cu; EIS; SEM; Si; X-ray diffraction; XRD; copper sheet; corrosion resistance; crystal orientation; cuprous oxide; electrochemical impedance spectroscopy; morphology; nanostructured copper thin film; p-type single crystal silicon; passive layer; potentiodynamic polarisation; radio frequency sputtering; scanning electron microscopy;

fLanguage

English

Journal_Title

Micro & Nano Letters, IET

Publisher

iet

ISSN

1750-0443

Type

jour

DOI

10.1049/mnl.2009.0111

Filename

5457352