Title :
Cross-cultural active learning: Qualitative results from Americans teaching in China
Author :
Lord, Susan M. ; Wang Jiajia ; Chang, Victor W. ; Yinghui Kuang ; Yongming Tang
Author_Institution :
Shiley-Marcos Sch. of Eng., Univ. of San Diego, San Diego, CA, USA
Abstract :
What are the experiences of Chinese students taking engineering courses taught in English by American professors using active learning techniques? Case studies of three such courses are explored in this work. Specifically, two American professors taught courses in English to about 100 students whose native language was Chinese. These courses included a required Electronics course for electrical engineering sophomores, a seminar on Medical Device New Product Development within a required Biomedical Instrumentation course for juniors in biomedical engineering, and a lecture series on New Product Development for first year honors students. All courses included homework teams and active learning techniques in the classroom. Focus groups were conducted near the end of the courses to examine students´ experiences. Results and analyses of this qualitative data are presented here. Themes which emerged include the importance of teamwork, challenges with and comfort gained using English, conflicting attitudes toward teaching style, and exposure to practical applications.
Keywords :
biomedical education; educational courses; electronic engineering education; engineering education; natural languages; Americans teaching; China; Chinese students; English language; biomedical engineering; biomedical instrumentation course; cross-cultural active learning technique; electrical engineering sophomores; electronics course; engineering courses; focus groups; homework teams; medical device new product development; qualitative data; student experiences; Cultural differences; Educational institutions; Engineering education; Product development; Seminars; Teamwork; China; U.S.; active learning;
Conference_Titel :
Global Engineering Education Conference (EDUCON), 2014 IEEE
Conference_Location :
Istanbul
DOI :
10.1109/EDUCON.2014.6826105