Abstract :
This month´s CEDA Currents newsletter addresses thermal-aware floorplanning for 3D MPSoCs; design automation and Smart Grid II; the IEEE Embedded Systems Letters´ most-accessed articles recently; and upcoming CEDA events.
Keywords :
DAC 2011; DATC; FMCAD 2011; GLSVLSI 2011; IEEE Embedded Systems Letter; MPSoC; MemoCODE 2011; PATMOS 2011; VLSI-SoC 2011; design and test; floorplanning; thermal-aware;
Journal_Title :
Design & Test of Computers, IEEE
DOI :
10.1109/MDT.2011.29
