DocumentCode :
1483110
Title :
Emerging multigigahertz digital and mixed-signal integrated circuits targeted for military applications: dependence on advanced electronic packaging to achieve full performance
Author :
Gilbert, Barry K. ; Degerstrom, Michael J. ; Zabinski, Patrick J. ; Schafer, T.M. ; Fokken, Gregg J. ; Randall, Barbara A. ; Schwab, Daniel J. ; Daniel, Erik S. ; Sommerfeldt, Scott C.
Author_Institution :
Dev. of Special Purposed Processor Dev. Group, Mayo Foundation, Rochester, MN, USA
Volume :
89
Issue :
4
fYear :
2001
fDate :
4/1/2001 12:00:00 AM
Firstpage :
426
Lastpage :
443
Abstract :
A revolution is occurring in several device and integrated circuit technologies (silicon CMOS and its extensions such as silicon germanium and silicon on insulator [SOI] and the so-called III-V compound semiconductors including indium phosphide and gallium arsenide), as well as in solid-state sensors such as infrared detectors enabled by the new materials and devices. These new components are being used to enhance the performance of many systems, and even to create systems never before available, of present interest to the U.S. Department of Defense and of likely near-term interest to parts of the commercial electronics industry such as the landline, wireless, and satellite telecommunications industry. These new components require advanced electronic packaging that does not restrict or degrade their performance. Unfortunately largely due to commercial cost pressures, research in and small-lot manufacture of high-performance packaging though still feasible and not lacking for good ideas for possible enhancement, are no longer being actively pursued either by the principal U.S. government agencies (e.g., DARPA, Air Force), by the commercial electronic packaging industry, or by commercial consortia such as the Microelectronics and Computer Technology Corporation (defunct as of June 2000), Semiconductor Research Corporation (SRC), or Sematech Inc. This paper discusses recent examples of high-performance components and integrated circuit technologies and describes how they are being exploited in new or upgraded systems. Advances in packaging technology that will be required to support the new integrated circuits are also described. In conclusion, several possible approaches are reviewed by which the United States can regain momentum in the development of performance-driven packaging technologies
Keywords :
digital integrated circuits; integrated circuit packaging; military equipment; mixed analogue-digital integrated circuits; United States; digital integrated circuits; electronic packaging; military applications; mixed-signal integrated circuits; CMOS technology; Computer aided manufacturing; Electronics industry; Electronics packaging; III-V semiconductor materials; Integrated circuit packaging; Integrated circuit technology; Manufacturing industries; Silicon germanium; Silicon on insulator technology;
fLanguage :
English
Journal_Title :
Proceedings of the IEEE
Publisher :
ieee
ISSN :
0018-9219
Type :
jour
DOI :
10.1109/5.920576
Filename :
920576
Link To Document :
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