• DocumentCode
    1483137
  • Title

    The future of wires

  • Author

    Ho, Ron ; Mai, Kenneth W. ; Horowitz, Mark A.

  • Author_Institution
    Dept. of Comput. Sci., Stanford Univ., CA, USA
  • Volume
    89
  • Issue
    4
  • fYear
    2001
  • fDate
    4/1/2001 12:00:00 AM
  • Firstpage
    490
  • Lastpage
    504
  • Abstract
    Concern about the performance of wires wires in scaled technologies has led to research exploring other communication methods. This paper examines wire and gate delays as technologies migrate from 0.18-μm to 0.035-μm feature sizes to better understand the magnitude of the the wiring problem. Wires that shorten in length as technologies scale have delays that either track gate delays or grow slowly relative to gate delays. This result is good news since these “local” wires dominate chip wiring. Despite this scaling of local wire performance, computer-aided design (CAD) tools must still become move sophisticated in dealing with these wires. Under scaling, the total number of wires grows exponentially, so CAD tools will need to handle an ever-growing percentage of all the wires in order to keep designer workloads constant. Global wires present a more serious problem to designers. These are wires that do not scale in length since they communicate signals across the chip. The delay of these wives will remain constant if repeaters are used meaning that relative to gate delays, their delays scale upwards. These increased delays for global communication will drive architectures toward modular designs with explicit global latency mechanisms
  • Keywords
    delays; integrated circuit interconnections; technological forecasting; wires (electric); 0.035 to 0.18 micron; computer-aided design; gate delay; integrated circuit interconnection; wire delay; wire technology; Delay; Design automation; Global communication; Hip; Integrated circuit interconnections; Integrated circuit technology; Paper technology; Repeaters; Wires; Wiring;
  • fLanguage
    English
  • Journal_Title
    Proceedings of the IEEE
  • Publisher
    ieee
  • ISSN
    0018-9219
  • Type

    jour

  • DOI
    10.1109/5.920580
  • Filename
    920580