DocumentCode
1483480
Title
Thermal microscopy of spin-valve and magnetoresistive devices
Author
Lederman, M. ; Richardson, D. ; Tong, H.C.
Author_Institution
Read-Rite Corp., Fremont, CA, USA
Volume
33
Issue
5
fYear
1997
fDate
9/1/1997 12:00:00 AM
Firstpage
2923
Lastpage
2925
Abstract
A thermal scanning microscope has been used to characterize the temperature of the different constituents of a thin film recording head under bias conditions. It shows that the temperature rise is highly concentrated in the current-biased read sensor. The results confirm calculations showing that most of the heat is dissipated through the shields, with the slider substrate acting as a heat sink. They also indicate that in SAL type AMR heads, the AMR layer is hotter than the SAL
Keywords
magnetic heads; magnetic thin film devices; magnetoresistive devices; microscopy; SAL AMR head; current-biased read sensor; heat dissipation; heat sink; magnetoresistive device; shield; slider substrate; spin-valve; temperature rise; thermal scanning microscopy; thin film recording head; Anisotropic magnetoresistance; Heat sinks; Magnetic force microscopy; Magnetic heads; Magnetic sensors; Magnetoresistive devices; Sensor phenomena and characterization; Substrates; Temperature sensors; Transistors;
fLanguage
English
Journal_Title
Magnetics, IEEE Transactions on
Publisher
ieee
ISSN
0018-9464
Type
jour
DOI
10.1109/20.617799
Filename
617799
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