DocumentCode
1483552
Title
Three-dimensional numerical simulation of local oxidation of silicon
Author
Umimoto, Hiroyuki ; Odanaka, Shinji
Author_Institution
Matsushita Elec. Ind. Co. Ltd., Osaka, Japan
Volume
38
Issue
3
fYear
1991
fDate
3/1/1991 12:00:00 AM
Firstpage
505
Lastpage
511
Abstract
The nitride mask bending stress is modeled in three dimensions by using the beam bending theory. The stress effect on the oxide growth is taken into account for the accurate evaluation of the oxide shape. The three-dimensional behavior of oxide growth is investigated by using three typical mask structures, which are called the hole (contact), island, and line structures. The mask structure effect and narrow mask effect on the bird´s beak length are simulated and discussed in comparison with the experimental data obtained by the top-view scanning electron microscopy (SEM) observation. Three-dimensional effects of the oxide thickness of local oxidation of silicon (LOCOS) structures are predicted by comparing simulations with two-dimensional effects obtained by the cross-sectional SEM observation. It is found that the bird´s beak length at the corner of the mask edge is much enhanced in the hole structure and retarded in the island structure. This result is explained by the three-dimensional effect on the oxidant diffusion and the nitride bending stress
Keywords
elemental semiconductors; masks; oxidation; scanning electron microscope examination of materials; semiconductor technology; silicon; LOCOS; beam bending theory; bird´s beak length; cross-sectional SEM observation; hole structures; island structures; line structures; local oxidation; mask structures; narrow mask effect; nitride mask bending stress; oxidant diffusion; oxide growth; three-dimensional behavior; top-view scanning electron microscopy; Fabrication; Geometry; Numerical models; Numerical simulation; Oxidation; Predictive models; Shape; Silicon; Stress; Very large scale integration;
fLanguage
English
Journal_Title
Electron Devices, IEEE Transactions on
Publisher
ieee
ISSN
0018-9383
Type
jour
DOI
10.1109/16.75159
Filename
75159
Link To Document